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research-article

Topology Optimization under Stress Relaxation Effect via Internal Element Connectivity Parameterization

[+] Author and Article Information
Meisam Takalloozadeh

Shiraz University, Engineering department, Zand Blvd., Shiraz, Iran
takalloozadeh@shirazu.ac.ir

Gilho Yoon

Hanyang University, Engineering Center 202-2, Hanyang University, 222 Wangsimni-ro, 133-791, Seong donggu, Seoul, Korea
ghy@hanyang.ac.krgilho.yoon@gmail.com

1Corresponding author.

ASME doi:10.1115/1.4041578 History: Received April 17, 2018; Revised September 20, 2018

Abstract

The creep phenomenon significantly affects stress and displacement distribution in structures. Redistribution of the stress field is one of the effects of creep and is termed as stress relaxation. The importance of stress relaxation in the design of structures is increasing owing to engineering applications especially at high temperatures. However, the phenomenon is largely unexplored by extant structural optimization studies. In the present study, the effect of stress relaxation due to high-temperature creep is considered in topology optimization (TO). Internal element connectivity parameterization (I-ECP) method is utilized for performing TO. The method is effective in overcoming numerical instabilities in nonlinear problems. Time-dependent adjoint sensitivity formulation is implemented for I-ECP including the creep effect. Several benchmark problems are solved, and the optimum layouts obtained by linear and nonlinear methods are compared to demonstrate the efficiency of the proposed method and to show the effect of stress relaxation on the optimum layout.

Copyright (c) 2018 by ASME
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