Abstract

Rectangular laminar microchannel heat sinks have been used for cooling banks of integrated circuits, semiconductor laser diodes, radar components and optical devices all of which may generate high heat flux. The effect of varying the fin width to channel width ratio and the channel aspect ratio was investigated for silicon heat sinks and the design which provided the minimum base temperature for a given heat transfer rate and given pumping power was recommended. The recommended design had fin width to channel width ratios of 1.3 and 2.4 and channel aspect ratios of 21.2 and 32.8 for water and Fluorinert (FC-5312) coolants respectively. The constant properties, fully developed assumptions were evaluated and were shown to be acceptable for the recommended geometry.

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