Abstract

The dynamic behavior of a miniaturized sensor module that is structurally integrated into the raceway of a ball bearing was studied. Modal analysis was conducted to identify critical bearing operational speeds and their effects on the electronic components of the module. Forced vibrations of the module under various loading conditions were studied to quantify deflection and stress within the module. The study provides insight and guidance to the design, configuration, and packaging of the module before its realization using an IC foundry.

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