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Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997

Paper No: IMECE1997-1107

DOI: https://doi.org/10.1115/IMECE1997-1107

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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998

Paper No: IMECE1998-0423

DOI: https://doi.org/10.1115/IMECE1998-0423

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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999

Paper No: IMECE1999-0967

DOI: https://doi.org/10.1115/IMECE1999-0967

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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems

Proceedings Papers

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

T. E. Wong, F. W. Palmieri, L. A. Kachatorian

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000

Paper No: IMECE2000-2252

DOI: https://doi.org/10.1115/IMECE2000-2252

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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Vibration, Random vibration, Solders, Ball-Grid-Array packages, Ceramics, Computation, Computers

Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young

Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000

Paper No: IMECE2000-2253

DOI: https://doi.org/10.1115/IMECE2000-2253

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Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data

Proceedings Papers

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

Jenn-Jiang Hwang, Chung-Hsing Chao

Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 399-405, November 5–10, 2000

Paper No: IMECE2000-1545

DOI: https://doi.org/10.1115/IMECE2000-1545

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Topics: Ball-Grid-Array packages, Cooling, Heat sinks, Metals

Proceedings Papers

A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package

Wei Wang, Tung Nguyen

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A078, November 14–20, 2014

Paper No: IMECE2014-38889

DOI: https://doi.org/10.1115/IMECE2014-38889

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Topics: Ball-Grid-Array packages, Fatigue, Modeling, Solder joints, Fatigue life, Finite element methods, Solders, Young's modulus, Materials properties, Temperature

Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012

Paper No: IMECE2012-89799

DOI: https://doi.org/10.1115/IMECE2012-89799

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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages

Proceedings Papers

Life Prediction Model Development of BGA Solder Joint Under Random Vibration

Changwoon Han, Chul-Min Oh, Won-Sik Hong

Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 987-988, November 11–17, 2011

Paper No: IMECE2011-62997

DOI: https://doi.org/10.1115/IMECE2011-62997

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Topics: Ball-Grid-Array packaging, Model development, Random vibration, Solder joints, Instrumentation, Vehicles, Automotive industry, Ball-Grid-Array packages, Electronics, Engines

Proceedings Papers

Evaluation of a Stacked Package Utilizing LGA Devices

G. Srinivasan, S. Iyer, R. Havens, K. Srihari

Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 303-308, November 12–18, 2010

Paper No: IMECE2010-40899

DOI: https://doi.org/10.1115/IMECE2010-40899

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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Cycles, Density, Failure, Failure analysis, Lead-free solders, Manufacturing, Printed circuit boards, Reliability

Proceedings Papers

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Aniket Shirgaokar, Jeffrey Suhling

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 245-261, October 31–November 6, 2008

Paper No: IMECE2008-68274

DOI: https://doi.org/10.1115/IMECE2008-68274

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Topics: Electronics, Military systems, Reliability, Thermomechanics, Tradeoffs, Ball-Grid-Array packages, Alloys, Architecture, Regression models, Ceramics

Proceedings Papers

Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental

H. X. Shang, J. X. Gao, P. I. Nicholson

Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 153-161, October 31–November 6, 2008

Paper No: IMECE2008-66417

DOI: https://doi.org/10.1115/IMECE2008-66417

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Topics: Ball-Grid-Array packages, Solder joints, Thermal stresses, Ball-Grid-Array packaging, Finite element analysis, Temperature, High temperature, Interferometry, Reliability, Resolution (Optics)

Proceedings Papers

Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages

Zhenming Tang, Seungbae Park, H. C. John Lee, Soonwan Chung

Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 9-14, November 11–15, 2007

Paper No: IMECE2007-43159

DOI: https://doi.org/10.1115/IMECE2007-43159

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Topics: Adhesion, Ball-Grid-Array packages, Flip-chip, Lead-free solders, Fatigue life, Solders, Cycles, Cavities, Delamination, Failure

Proceedings Papers

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

S. M. Hsu, J. C. Lin, K. N. Chiang

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 311-318, November 17–22, 2002

Paper No: IMECE2002-39674

DOI: https://doi.org/10.1115/IMECE2002-39674

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Topics: Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages, Reliability, Finite element model, Design, Computation, Ball-Grid-Array packages, Ceramics

Proceedings Papers

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

Joe Chu, Maosen Chen, Wyeman Chen

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 215-225, November 17–22, 2002

Paper No: IMECE2002-39499

DOI: https://doi.org/10.1115/IMECE2002-39499

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Topics: Ball-Grid-Array packages, Density, Manufacturing, Design, Design for Manufacturing, Electronics

Proceedings Papers

High-Lead Solder Ball Characteristics in BGA Package

Nicholas Kao, Y. P. Wang, C. S. Hsiao

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 445-450, November 17–22, 2002

Paper No: IMECE2002-39687

DOI: https://doi.org/10.1115/IMECE2002-39687

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Topics: Ball-Grid-Array packages, Shear strength, Solder joints, Solders, Shear (Mechanics), Alloys, Elongation, Lead alloys, Melting, Reliability

Proceedings Papers

High Cycle Vibration Testing of BGA Packages

Valmiki K. Sooklal, Michael C. Larson, Xia Liu

Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 291-296, November 17–22, 2002

Paper No: IMECE2002-39672

DOI: https://doi.org/10.1115/IMECE2002-39672

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Topics: Ball-Grid-Array packages, Cycles, Testing, Vibration, Ball-Grid-Array packaging, Crack propagation, Failure, Finite element analysis, Fracture (Materials), Interferometry

Proceedings Papers

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

Donghyun Kim, Andrew Mawer, Glenn Y. Masada, Tess J. Moon

Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 505-514, November 15–21, 2003

Paper No: IMECE2003-43236

DOI: https://doi.org/10.1115/IMECE2003-43236

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Topics: Fracture (Materials), Modeling, Solder joints, Ball-Grid-Array packages, Compressive stress, Creep, Damage, Electronic packages, Engineering simulation, Finite element methods

NARROW

Thermal Performance Evaluation of VBGA Packages

Stress Analysis of High Density Bare Chip Packaging Technologies

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

Thermomechanical Durability of High I/O BGA Packages

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Life Prediction Model Development of BGA Solder Joint Under Random Vibration

Evaluation of a Stacked Package Utilizing LGA Devices

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental

Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

High-Lead Solder Ball Characteristics in BGA Package

High Cycle Vibration Testing of BGA Packages

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

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