Skip Nav Destination
Close Modal
Update search
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
Filter
- Title
- Author
- Author Affiliations
- Full Text
- Abstract
- Keyword
- DOI
- ISBN
- ISBN-10
- ISSN
- EISSN
- Issue
- Journal Volume Number
- References
- Conference Volume Title
- Paper No
NARROW
Date
Availability
1-20 of 27
Ball-Grid-Array packages
Close
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
1
Sort by
Proceedings Papers
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1107
Proceedings Papers
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
Proceedings Papers
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0423
Proceedings Papers
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
Proceedings Papers
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0967
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2252
Proceedings Papers
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2253
Proceedings Papers
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 399-405, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1545
Proceedings Papers
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A078, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38889
Proceedings Papers
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89799
Proceedings Papers
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 987-988, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62997
Proceedings Papers
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 303-308, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40899
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 245-261, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68274
Proceedings Papers
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 153-161, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66417
Proceedings Papers
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 9-14, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43159
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 311-318, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39674
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 215-225, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39499
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 445-450, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39687
Proceedings Papers
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 291-296, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39672
Proceedings Papers
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 505-514, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43236
1