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Proceedings Papers

Thermal Performance Evaluation of VBGA Packages

Wen C. Zheng, Paul Y. F. Wu, James J. D. Lan
Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 329-337, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-1107
https://doi.org/10.1115/IMECE1997-1107
View Paper titled, Thermal Performance Evaluation of VBGA Packages
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Topics: Air flow, Ball-Grid-Array packages, Engineering simulation, Finite element methods, Finite element model, Heat transfer coefficients, Modeling, Performance evaluation, Simulation, Thermal resistance
Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura
Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1997-0499
https://doi.org/10.1115/IMECE1997-0499
View Paper titled, Stress Analysis of High Density Bare Chip Packaging Technologies
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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip
Proceedings Papers

Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique

Hsien-Chie Cheng, Kuo-Ning Chiang, Chao-Kuang Chen
Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 13-20, November 15–20, 1998
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1998-0423
https://doi.org/10.1115/IMECE1998-0423
View Paper titled, Parametric Analysis of Thermally Enhanced BGA Reliability Using a Finite-Volume-Weighted Averaging Technique
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Topics: Ball-Grid-Array packaging, Reliability, Solder joints, Ball-Grid-Array packages, Design, Fatigue, Geometry, Corners (Structural elements), Finite element analysis, Manufacturing
Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0966
https://doi.org/10.1115/IMECE1999-0966
View Paper titled, An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool
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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages
Proceedings Papers

A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages

T. M. Ying, K. C. Toh
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 29-36, November 14–19, 1999
Publisher: American Society of Mechanical Engineers
Paper No: IMECE1999-0967
https://doi.org/10.1115/IMECE1999-0967
View Paper titled, A Constriction Resistance Model in Thermal Analysis of Solder Ball Joints in Ball Grid Array Packages
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Topics: Ball-Grid-Array packages, Solders, Thermal analysis, Ball-Grid-Array packaging, Solder joints, Energy dissipation, Finite element methods, Finite element model, Heat, Boundary-value problems
Proceedings Papers

Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint

T. E. Wong, F. W. Palmieri, L. A. Kachatorian
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 113-119, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2252
https://doi.org/10.1115/IMECE2000-2252
View Paper titled, Experimentally Validated Vibration Fatigue Life Prediction Model for Ball Grid Array Solder Joint
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Topics: Ball-Grid-Array packaging, Fatigue life, Solder joints, Vibration, Random vibration, Solders, Ball-Grid-Array packages, Ceramics, Computation, Computers
Proceedings Papers

Thermomechanical Durability of High I/O BGA Packages

Pavan Davuluri, Abhijit Dasgupta, Steven Young
Proc. ASME. IMECE2000, Packaging of Electronic and Photonic Devices, 121-127, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-2253
https://doi.org/10.1115/IMECE2000-2253
View Paper titled, Thermomechanical Durability of High I/O BGA Packages
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Topics: Ball-Grid-Array packages, Durability, Thermomechanics, Ball-Grid-Array packaging, Solder joints, Failure, Solders, Cycles, Damage, Failure data
Proceedings Papers

Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

Jenn-Jiang Hwang, Chung-Hsing Chao
Proc. ASME. IMECE2000, Heat Transfer: Volume 4, 399-405, November 5–10, 2000
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2000-1545
https://doi.org/10.1115/IMECE2000-1545
View Paper titled, Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks
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Topics: Ball-Grid-Array packages, Cooling, Heat sinks, Metals
Proceedings Papers

A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package

Wei Wang, Tung Nguyen
Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A078, November 14–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2014-38889
https://doi.org/10.1115/IMECE2014-38889
View Paper titled, A Modeling Study of the Effect of Underfill Materials on Solder Joint Thermal Fatigue of Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Fatigue, Modeling, Solder joints, Fatigue life, Finite element methods, Solders, Young's modulus, Materials properties, Temperature
Proceedings Papers

Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation

Hohyung Lee, Seungbae Park
Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 485-490, November 9–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2012-89799
https://doi.org/10.1115/IMECE2012-89799
View Paper titled, Creep Strain Measurement of an Actual Leadfree Solder Interconnect Using Digital Image Correlation
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Topics: Creep, Lead-free solders, Strain measurement, Solders, Solder joints, Ball-Grid-Array packaging, Displacement, Temperature, Alloys, Ball-Grid-Array packages
Proceedings Papers

Life Prediction Model Development of BGA Solder Joint Under Random Vibration

Changwoon Han, Chul-Min Oh, Won-Sik Hong
Proc. ASME. IMECE2011, Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration, 987-988, November 11–17, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2011-62997
https://doi.org/10.1115/IMECE2011-62997
View Paper titled, Life Prediction Model Development of BGA Solder Joint Under Random Vibration
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Topics: Ball-Grid-Array packaging, Model development, Random vibration, Solder joints, Instrumentation, Vehicles, Automotive industry, Ball-Grid-Array packages, Electronics, Engines
Proceedings Papers

Evaluation of a Stacked Package Utilizing LGA Devices

G. Srinivasan, S. Iyer, R. Havens, K. Srihari
Proc. ASME. IMECE2010, Volume 4: Electronics and Photonics, 303-308, November 12–18, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2010-40899
https://doi.org/10.1115/IMECE2010-40899
View Paper titled, Evaluation of a Stacked Package Utilizing LGA Devices
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Topics: Ball-Grid-Array packages, Ball-Grid-Array packaging, Cycles, Density, Failure, Failure analysis, Lead-free solders, Manufacturing, Printed circuit boards, Reliability
Proceedings Papers

Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics

Pradeep Lall, Aniket Shirgaokar, Jeffrey Suhling
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 245-261, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-68274
https://doi.org/10.1115/IMECE2008-68274
View Paper titled, Models for Component Selection and Thermo-Mechanical Reliability Trade-Offs to Address Component Obsolescence in Military Electronics
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Topics: Electronics, Military systems, Reliability, Thermomechanics, Tradeoffs, Ball-Grid-Array packages, Alloys, Architecture, Regression models, Ceramics
Proceedings Papers

Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental

H. X. Shang, J. X. Gao, P. I. Nicholson
Proc. ASME. IMECE2008, Volume 6: Electronics and Photonics, 153-161, October 31–November 6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2008-66417
https://doi.org/10.1115/IMECE2008-66417
View Paper titled, Thermal Stress Measurement of Solder Joints in BGA Packages: Theoretical and Experimental
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Topics: Ball-Grid-Array packages, Solder joints, Thermal stresses, Ball-Grid-Array packaging, Finite element analysis, Temperature, High temperature, Interferometry, Reliability, Resolution (Optics)
Proceedings Papers

Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages

Zhenming Tang, Seungbae Park, H. C. John Lee, Soonwan Chung
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 9-14, November 11–15, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2007-43159
https://doi.org/10.1115/IMECE2007-43159
View Paper titled, Effect of Board-Level Reflow on Adhesion Between Lead-Free Solder and Underfill in Flip-Chip BGA Packages
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Topics: Adhesion, Ball-Grid-Array packages, Flip-chip, Lead-free solders, Fatigue life, Solders, Cycles, Cavities, Delamination, Failure
Proceedings Papers

A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package

S. M. Hsu, J. C. Lin, K. N. Chiang
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 311-318, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39674
https://doi.org/10.1115/IMECE2002-39674
View Paper titled, A Full-Scale 3D Finite Element Analysis for No-Underfill Flip Chip Package
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Topics: Finite element analysis, Flip-chip, Flip-chip devices, Flip-chip packages, Reliability, Finite element model, Design, Computation, Ball-Grid-Array packages, Ceramics
Proceedings Papers

Evaluating the Assembly of Mirrored Large High-Density BGA Packages

Joe Chu, Maosen Chen, Wyeman Chen
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 215-225, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39499
https://doi.org/10.1115/IMECE2002-39499
View Paper titled, Evaluating the Assembly of Mirrored Large High-Density BGA Packages
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Topics: Ball-Grid-Array packages, Density, Manufacturing, Design, Design for Manufacturing, Electronics
Proceedings Papers

High-Lead Solder Ball Characteristics in BGA Package

Nicholas Kao, Y. P. Wang, C. S. Hsiao
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 445-450, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39687
https://doi.org/10.1115/IMECE2002-39687
View Paper titled, High-Lead Solder Ball Characteristics in BGA Package
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Topics: Ball-Grid-Array packages, Shear strength, Solder joints, Solders, Shear (Mechanics), Alloys, Elongation, Lead alloys, Melting, Reliability
Proceedings Papers

High Cycle Vibration Testing of BGA Packages

Valmiki K. Sooklal, Michael C. Larson, Xia Liu
Proc. ASME. IMECE2002, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 291-296, November 17–22, 2002
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2002-39672
https://doi.org/10.1115/IMECE2002-39672
View Paper titled, High Cycle Vibration Testing of BGA Packages
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Topics: Ball-Grid-Array packages, Cycles, Testing, Vibration, Ball-Grid-Array packaging, Crack propagation, Failure, Finite element analysis, Fracture (Materials), Interferometry
Proceedings Papers

Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation

Donghyun Kim, Andrew Mawer, Glenn Y. Masada, Tess J. Moon
Proc. ASME. IMECE2003, Electronic and Photonic Packaging, Electrical Systems and Photonic Design, and Nanotechnology, 505-514, November 15–21, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2003-43236
https://doi.org/10.1115/IMECE2003-43236
View Paper titled, Modeling and Analysis of Crack Growth in SnPb and SnAgCu Solder Joints in PBGA Packages: Part I — Crack Initiation
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Topics: Fracture (Materials), Modeling, Solder joints, Ball-Grid-Array packages, Compressive stress, Creep, Damage, Electronic packages, Engineering simulation, Finite element methods