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Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997

Paper No: IMECE1997-0811

DOI: https://doi.org/10.1115/IMECE1997-0811

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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses

Proceedings Papers

Manufacturability of Underfill Processing for Low Cost Flip Chip

Daniel F. Baldwin, Nathan W. Pascarella

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 21-31, November 16–21, 1997

Paper No: IMECE1997-0812

DOI: https://doi.org/10.1115/IMECE1997-0812

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Topics: Flip-chip, Flip-chip devices, Flow (Dynamics), Compression, Electronics, Manufacturing, Printed circuit boards, Reliability, Semiconductor devices, Surface mount packaging

Proceedings Papers

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

Prema Palaniappan, Daniel F. Baldwin

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 7-14, November 16–21, 1997

Paper No: IMECE1997-1221

DOI: https://doi.org/10.1115/IMECE1997-1221

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Topics: Density, Electronics, Flip-chip, Flip-chip assemblies, Flip-chip devices, Fracture (Materials), Fracture (Process), Glass transition, Manufacturing, Printed circuit boards

Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997

Paper No: IMECE1997-1233

DOI: https://doi.org/10.1115/IMECE1997-1233

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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Carole A. Le Gall, Jianmin Qu, David L. McDowell

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 85-95, November 16–21, 1997

Paper No: IMECE1997-0503

DOI: https://doi.org/10.1115/IMECE1997-0503

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Topics: Flip-chip, Flip-chip devices, Reliability, Thermomechanics, Stress, Creep, Dimensions, Elasticity, Flip-chip assemblies, Geometry

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Xiang Dai, Mark V. Brillhart, Paul S. Ho

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 115-124, November 16–21, 1997

Paper No: IMECE1997-0506

DOI: https://doi.org/10.1115/IMECE1997-0506

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Topics: Adhesion, Flip-chip packages, Delamination, Failure, Flip-chip, Flip-chip assemblies, Fracture mechanics, Junctions, Manufacturing, Polymers

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Sven Rzepka, Matt A. Korhonen, Ekkehard Meusel, Che-Yu Li

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 73-83, November 16–21, 1997

Paper No: IMECE1997-0502

DOI: https://doi.org/10.1115/IMECE1997-0502

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Topics: Delamination, Flip-chip, Flip-chip devices, Reliability, Solders, Tension, Failure, Solder joints, Adhesion, Compressive stress

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

Ryan Thorpe, Lawrence P. McGovern, Daniel F. Baldwin

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 27-33, November 15–20, 1998

Paper No: IMECE1998-0425

DOI: https://doi.org/10.1115/IMECE1998-0425

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Topics: Flip-chip, Flip-chip devices, Manufacturing, Flow (Dynamics), Solders, Vehicles, Compression, Ovens, Printing

Proceedings Papers

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Kuo-Ning Chiang, Hsien-Chie Cheng

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 21-25, November 15–20, 1998

Paper No: IMECE1998-0424

DOI: https://doi.org/10.1115/IMECE1998-0424

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Topics: Reliability, Solder joints, Solders, Ball-Grid-Array packaging, Geometry, Fatigue life, Flip-chip, Flip-chip devices, Materials properties

Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998

Paper No: IMECE1998-0426

DOI: https://doi.org/10.1115/IMECE1998-0426

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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination

Proceedings Papers

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Jianbiao Pan, Gregory L. Tonkay

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 75-82, November 14–19, 1999

Paper No: IMECE1999-0920

DOI: https://doi.org/10.1115/IMECE1999-0920

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Topics: Printing, Solders, Ball-Grid-Array packaging, Surface mount assemblies, Flip-chip, Flip-chip devices, Packaging

Proceedings Papers

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

V. H. Adams, K. Ramakrishna

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 99-106, November 14–19, 1999

Paper No: IMECE1999-0922

DOI: https://doi.org/10.1115/IMECE1999-0922

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Topics: Electronic packages, Heating, Performance characterization, Silicon, Heat, Temperature, Thermal characterization, Ball-Grid-Array packaging, Engineering simulation, Junctions

Proceedings Papers

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Lei L. Mercado, Tien-Yu Tom Lee, Jeff Cook

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 111-119, November 14–19, 1999

Paper No: IMECE1999-0924

DOI: https://doi.org/10.1115/IMECE1999-0924

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Topics: Thermal shock, Transients (Dynamics), Computational fluid dynamics, Stress, Boundary-value problems, Ball-Grid-Array packaging, Flip-chip, Heat transfer, Heat transfer coefficients, Molded plastics

Proceedings Papers

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

Ryan Thorpe, Daniel F. Baldwin

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 33-38, November 14–19, 1999

Paper No: IMECE1999-0914

DOI: https://doi.org/10.1115/IMECE1999-0914

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Topics: Event history analysis, Flip-chip, Flip-chip devices, Flow (Dynamics), Reliability

Proceedings Papers

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Tien-Yu Tom Lee

Proc. ASME. IMECE99, Heat Transfer: Volume 1, 21-28, November 14–19, 1999

Paper No: IMECE1999-0966

DOI: https://doi.org/10.1115/IMECE1999-0966

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Topics: Ball-Grid-Array packages, Computational fluid dynamics, Flip-chip, Flip-chip devices, Flat heat pipes, Heat sinks, Heat transfer, Aluminum, Copper, Flip-chip packages

Proceedings Papers

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

K. Ramakrishna, T.-Y. Lee

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 139-148, November 11–16, 2001

Paper No: IMECE2001/HTD-24387

DOI: https://doi.org/10.1115/IMECE2001/HTD-24387

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Topics: Ball-Grid-Array packaging, Junctions, Mixed convection, Computation, Computational fluid dynamics, Databases, Flip-chip, Heat transfer, Thermal resistance

2 3 4 5

NARROW

Assessment of Chip-Scale Package Design Options

Manufacturability of Underfill Processing for Low Cost Flip Chip

In Process Stress Analysis of Flip Chip Assemblies During Underfill Cure

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Some Mechanics Issues Related to the Thermomechanical Reliability of Flip Chip DCA With Underfill Encapsulation

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Investigation of Underfill Adhesion in Plastic Flip-Chip Packages

Stress Analysis of High Density Bare Chip Packaging Technologies

The Effect of Underfill Delamination on the Reliability of Flip Chip Modules

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Analysis of Process Yield in Low Cost Flip Chip on Board Assembly Processes

On Enhancing Eutectic Solder Joint Reliability Using a 2 nd -Reflow-Process Approach

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

A Study of the Aperture Filling Process in Solder Paste Stencil Printing

Impact of On-Die Discrete Heating on Thermal Performance Characteristics of Silicon Based IC Electronic Packages

Integrated Transient Thermal and Mechanical Analysis of Molded PBGA Packages During Thermal Shock

Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials

An Investigation of Thermal Enhancement on Flip Chip Plastic BGA Packages Using CFD Tool

Prediction of Thermal Performance of Flip-Chip-Plastic Ball Grid Array (FC-PBGA) Packages: Effect of Die Size

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