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Proceedings Papers

Transport in Fibrous Battery Electrode Substrates

A. M. Sastry, X. Cheng, S. B. Choi

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 331-338, November 16–21, 1997

Paper No: IMECE1997-0679

DOI: https://doi.org/10.1115/IMECE1997-0679

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Topics: Batteries, Electrodes, Electrical conductivity, Thermal conductivity, Active materials, Chemical reactions, Cycles, Electrochemical reactions, Failure, Heat conduction

Proceedings Papers

Boiling Heat Transfer From a Micro Heater

Kunio Hijikata, Norihiko Yamamoto, Shu Takagi

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 135-142, November 16–21, 1997

Paper No: IMECE1997-0951

DOI: https://doi.org/10.1115/IMECE1997-0951

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Topics: Boiling, Heat transfer, Bubbles, Vapors, Coolants, Fluctuations (Physics), Glass, Heat, Heat conduction, Size effect

Proceedings Papers

Radiation Effects on Laminar Mixed Convection in an Inclined Square Duct

Wei-Mon Yan, Hung-Yi Li

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 233-242, November 16–21, 1997

Paper No: IMECE1997-0914

DOI: https://doi.org/10.1115/IMECE1997-0914

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Topics: Ducts, Mixed convection, Radiation effects, Radiation (Physics), Albedo, Electromagnetic scattering, Emissivity, Flow (Dynamics), Heat conduction, Heat transfer

Proceedings Papers

Development of a High Flux Conduction Calibration Apparatus

William L. Grosshandler, David Blackburn

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 153-158, November 16–21, 1997

Paper No: IMECE1997-0904

DOI: https://doi.org/10.1115/IMECE1997-0904

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Topics: Calibration, Heat conduction, Heat flux, Flux (Metallurgy), Gages, National Institute of Standards and Technology, Uncertainty, Boundary-value problems, Computer simulation, Condensers (steam plant)

Proceedings Papers

Theoretical Determination of the Laser Induced Damage Threshold for Ultrashort Pulse Laser Heating of Metal Films

Andrew N. Smith, Pamela M. Norris, Anthony S. Lee

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 161-169, November 16–21, 1997

Paper No: IMECE1997-0954

DOI: https://doi.org/10.1115/IMECE1997-0954

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Topics: Damage, Heating, Lasers, Metals, Equilibrium (Physics), Temperature, Design, Electrons, Heat conduction, Materials properties

Proceedings Papers

Development of a Grid Partial Analytical Solution Method for Solving the Moving Source Heat Conduction Problem

Xing Ouyang, Patricia J. Bishop

Proc. ASME. IMECE97, Heat Transfer: Volume 3, 319-327, November 16–21, 1997

Paper No: IMECE1997-0924

DOI: https://doi.org/10.1115/IMECE1997-0924

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Topics: Heat conduction, Errors, Partial differential equations

Proceedings Papers

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Y. Sungtaek Ju, Kenneth E. Goodson

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 181-190, November 16–21, 1997

Paper No: IMECE1997-0956

DOI: https://doi.org/10.1115/IMECE1997-0956

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Topics: Heat conduction, Phonons, Semiconductor films, Size effect, Thermal conductivity, Semiconductors (Materials), Silicon, Electromagnetic scattering, Radiation scattering, Scattering (Physics)

Proceedings Papers

Numerical and Experimental Study on Thermal Performance of Low Temperature Heat Pipe With Two Heaters

Jong Heung Park, Seong Pal Lee

Proc. ASME. IMECE97, Microelectromechanical Systems (MEMS), 231-238, November 16–21, 1997

Paper No: IMECE1997-0962

DOI: https://doi.org/10.1115/IMECE1997-0962

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Topics: Heat pipes, Low temperature, Heat, Computer simulation, Exterior walls, Temperature, Temperature profiles, Copper, Heat conduction, Heat transfer

Proceedings Papers

Parametric Analysis of Laminar Forced Convective Cooling of Heated Obstacle Arrays

Timothy J. Young

Proc. ASME. IMECE97, Advanced Energy Systems, 17-24, November 16–21, 1997

Paper No: IMECE1997-0969

DOI: https://doi.org/10.1115/IMECE1997-0969

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Topics: Cooling, Thermal conductivity, Flow (Dynamics), Fluids, Heating, Coolants, Finite element methods, Fluid dynamics, Heat, Heat conduction

Proceedings Papers

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Srinivas S. Sripada, P. S. Ayyaswamy, I. M. Cohen

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 55-61, November 16–21, 1997

Paper No: IMECE1997-0831

DOI: https://doi.org/10.1115/IMECE1997-0831

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Topics: Anodes, Computation, Flames, Heat transfer, Wire, Melting, Bonding, Computer simulation, Electric arcs, Heat

Proceedings Papers

Exact Solution of Heat Conduction in Composite Materials and Application to Inverse Problems

C. Aviles-Ramos, A. Haji-Sheikh, J. V. Beck

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 305-314, November 16–21, 1997

Paper No: IMECE1997-0856

DOI: https://doi.org/10.1115/IMECE1997-0856

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Topics: Composite materials, Heat conduction, Inverse problems, Heat flux, Temperature, Aerospace industry, Aircraft, Boundary-value problems, Computation, Cooling

Proceedings Papers

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Theodorian Borca Tasciuc, Gang Chen

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 297-303, November 16–21, 1997

Paper No: IMECE1997-0855

DOI: https://doi.org/10.1115/IMECE1997-0855

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Topics: Lasers, Microscopes, Thin films, Laser beams, Thermal diffusivity, Thermocouples, Waves, Bulk solids, Fittings, Glass

Proceedings Papers

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Jagannath Raghavan, Muhammad M. Rahman

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 337-346, November 16–21, 1997

Paper No: IMECE1997-0859

DOI: https://doi.org/10.1115/IMECE1997-0859

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Topics: Cross-flow, Heat, Printed circuit boards, Computer simulation, Flow (Dynamics), Fluids, Boundary layers, Convection, Forced convection, Heat conduction

Proceedings Papers

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Osamu Nakabeppu, Masanobu Igeta, Kunio Hijikata

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 287-295, November 16–21, 1997

Paper No: IMECE1997-0854

DOI: https://doi.org/10.1115/IMECE1997-0854

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Topics: Composite materials, Heat transfer, Carbon reinforced plastics, Resolution (Optics), Atomic force microscopy, Microscale devices, Pressure, Temperature, Visualization, Atmospheric pressure

Proceedings Papers

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

Sankar Sunder, Joseph L. Smith, Jr.

Proc. ASME. IMECE97, Advanced Energy Systems, 417-427, November 16–21, 1997

Paper No: IMECE1997-1015

DOI: https://doi.org/10.1115/IMECE1997-1015

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Topics: Heat transfer, Modeling, Pumps, Compression, Cycles, Displacement, Engines, Flow (Dynamics), Geometry, Heat conduction

Proceedings Papers

Evaluation of Die Stress Using van der Pauw Sensors

A. K. M. Mian, J. C. Suhling, R. C. Jaeger, B. M. Wilamowski

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 59-67, November 16–21, 1997

Paper No: IMECE1997-1228

DOI: https://doi.org/10.1115/IMECE1997-1228

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Topics: Sensors, Stress, Resistors, Silicon, Anisotropy, Electronic packaging, Heat conduction, Semiconductor wafers, Simulation results, Temperature

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 99-108, November 16–21, 1997

Paper No: IMECE1997-1219

DOI: https://doi.org/10.1115/IMECE1997-1219

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Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Proceedings Papers

Discussion of Non-Equilibrium Heat Transfer in Biological Systems

Lisa X. Xu, Jing Liu

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 13-17, November 15–20, 1998

Paper No: IMECE1998-0788

DOI: https://doi.org/10.1115/IMECE1998-0788

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Topics: Equilibrium (Physics), Heat transfer, Waves, Heat conduction, Porous materials, Heat, Pressure gradient, Water

Proceedings Papers

Mechanical Behavior of Bolted Joints Under Thermal Changes

Toshiyuki Sawa, Akira Muramatsu, Hiroyuki Kumano

Proc. ASME. IMECE98, Reliability, Stress Analysis, and Failure Prevention Aspects of Adhesive and Bolted Joints, Rubber Components, Composite Springs, 141-150, November 15–20, 1998

Paper No: IMECE1998-1125

DOI: https://doi.org/10.1115/IMECE1998-1125

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Topics: Bolted joints, Mechanical behavior, Cylinders, Heat conduction, Plates (structures), Stress, Temperature, Aluminum, Combustion, Design

Proceedings Papers

Electrorheology of Chitin and Chitosan Suspensions: Conductivity vs Molecular Structure

Ung-su Choi, Hans Conrad

Proc. ASME. IMECE98, Rheology and Fluid Mechanics of Nonlinear Materials, 145-151, November 15–20, 1998

Paper No: IMECE1998-0458

DOI: https://doi.org/10.1115/IMECE1998-0458

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Topics: Electrical conductivity, Electrorheological fluids, Thermal conductivity, Electric fields, Particulate matter, Flow (Dynamics), Fluids, Heat conduction, Rheology, Shear stress

2 3 4 5

NARROW

Transport in Fibrous Battery Electrode Substrates

Boiling Heat Transfer From a Micro Heater

Radiation Effects on Laminar Mixed Convection in an Inclined Square Duct

Development of a High Flux Conduction Calibration Apparatus

Theoretical Determination of the Laser Induced Damage Threshold for Ultrashort Pulse Laser Heating of Metal Films

Development of a Grid Partial Analytical Solution Method for Solving the Moving Source Heat Conduction Problem

Impact of Phonon Dispersion Upon the Size Effect on Thermal Conduction Along Thin Semiconductor Films

Numerical and Experimental Study on Thermal Performance of Low Temperature Heat Pipe With Two Heaters

Parametric Analysis of Laminar Forced Convective Cooling of Heated Obstacle Arrays

Numerical Computation of the Heat Transfer to a Spherical-Tip Anode During an Electronic Flame Off Process

Exact Solution of Heat Conduction in Composite Materials and Application to Inverse Problems

Scanning Laser Thermoelectric Microscope for Thin Film Thermophysical Property Measurement

Analysis of Mixed Convective Cross Flow Near Protruding Heat Sources on a Vertical Circuit Board

Microscopic Study on Heat Transfer and Thermophysical Properties of Composite Material

Lumped Parameter Thermodynamic and Heat Transfer Modeling of a Scroll Pump

Evaluation of Die Stress Using van der Pauw Sensors

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Discussion of Non-Equilibrium Heat Transfer in Biological Systems

Mechanical Behavior of Bolted Joints Under Thermal Changes

Electrorheology of Chitin and Chitosan Suspensions: Conductivity vs Molecular Structure

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