Search Results | IMECE | ASME Digital Collection

1-20 of 319

Sort by

Sort Order Select

Proceedings Papers

Potentials and Limitations of Concentrator Silicon Solar Cells Energy Utilization

Mohamed M. Elsabahy, Mohamed Emam, Hidetoshi Sekiguchi, Mahmoud Ahmed

Proc. ASME. IMECE2022, Volume 6: Energy, V006T08A056, October 30–November 3, 2022

Paper No: IMECE2022-95678

DOI: https://doi.org/10.1115/IMECE2022-95678

View Paper

Topics: Heat sinks, Silicon, Solar cells

Proceedings Papers

Investigation of Mass Savings Potential of Zeolite Integrated Motor Thermal Management Systems in All-Electric Commercial Aircraft

Nathan Malone, Sourav Chakravarty, Shiyu Zhang, Dorsa Talebi, Sri Vignesh Sankarraman, Erick Pool, Deokgeun Park, Ethan T. Iverson, Chase Wiley, Patrick Shamberger, Dion Antao, Matthew C. Gardner, Hamid Toliyat, Prasad Enjeti, Bryan Rasmussen, Jaime Grunlan, Moble Benedict, Jonathan Felts

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A040, October 30–November 3, 2022

Paper No: IMECE2022-96671

DOI: https://doi.org/10.1115/IMECE2022-96671

View Paper

Topics: Aerospace industry, Aircraft, Motors, Thermal management, Computational fluid dynamics, Computer simulation, Cooling, Cooling systems, Electric propulsion, Electromechanical systems

Proceedings Papers

Heat Transfer and Flow Characteristic of Sinusoidal Wavy Microchannel Heat Sink With Different Phase Shift

Abdul Aziz Shuvo, Md. Omarsany Bappy, Amitav Tikadar, Titan C. Paul, A. K. M. Monjur Morshed

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A023, October 30–November 3, 2022

Paper No: IMECE2022-95864

DOI: https://doi.org/10.1115/IMECE2022-95864

View Paper

Topics: Flow (Dynamics), Heat sinks, Heat transfer, Microchannels, Phase shift

Proceedings Papers

Electrohydrodynamic Conduction Pumping Driven Flow and Heat Transfer in a Flexible Minichannel

Deepak Selvakumar Ramachandran, Hyoungsoon Lee

Proc. ASME. IMECE2022, Volume 8: Fluids Engineering; Heat Transfer and Thermal Engineering, V008T11A009, October 30–November 3, 2022

Paper No: IMECE2022-89251

DOI: https://doi.org/10.1115/IMECE2022-89251

View Paper

Topics: Electrohydrodynamics, Flow (Dynamics), Heat conduction, Heat transfer, Fluid dynamics, Cooling, Electric potential, Flexible electronics, Heat sinks

Proceedings Papers

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

D. Angirasa, F. Pyrtle, III, G. P. Peterson

Proc. ASME. IMECE97, Heat Transfer: Volume 1, 279-285, November 16–21, 1997

Paper No: IMECE1997-0853

DOI: https://doi.org/10.1115/IMECE1997-0853

View Paper

Topics: Cooling, Electronic packages, Heat sinks, Temperature, Aluminum, Computer cooling, Heat, Heat transfer, Porosity, Reynolds number

Proceedings Papers

The Effect of Thermoelectric Cooler Mounting Orientation on Cooling Efficiency

Thomas E. Welling, Jr., Cheryl A. Bell, Muthar Al-Ubaidi

Proc. ASME. IMECE97, Advanced Energy Systems, 303-310, November 16–21, 1997

Paper No: IMECE1997-1002

DOI: https://doi.org/10.1115/IMECE1997-1002

View Paper

Topics: Cooling, Thermoelectric coolers, Heat sinks, Ducts, Cooling systems, System efficiency, Flow (Dynamics), Geometry, Heat exchangers, Heat pumps

Proceedings Papers

Absorption Heat Pump Performance Improvement Through Ground Coupling

Srinivas Garimella

Proc. ASME. IMECE97, Advanced Energy Systems, 327-335, November 16–21, 1997

Paper No: IMECE1997-1005

DOI: https://doi.org/10.1115/IMECE1997-1005

View Paper

Topics: Absorption, Heat pumps, Cooling, Heat, Heating, Heating and cooling, Stress, Climate, Combustion, Equilibrium (Physics)

Proceedings Papers

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Chang J. Park, Deborah A. Kaminski

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 99-108, November 16–21, 1997

Paper No: IMECE1997-1219

DOI: https://doi.org/10.1115/IMECE1997-1219

View Paper

Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Proceedings Papers

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

A.-F. Bastawros, A. G. Evans

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 1-6, November 16–21, 1997

Paper No: IMECE1997-1208

DOI: https://doi.org/10.1115/IMECE1997-1208

View Paper

Topics: Aluminum alloys, Foams (Chemistry), Heat sinks, Cross-flow, Cylinders, Dimensions, Fluid dynamics, Fluids, Heat transfer coefficients, Pressure drop

Proceedings Papers

The Recommended Geometry for Laminar Microchannel Heat Sinks

Jeffrey J. Lienau

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 47-54, November 16–21, 1997

Paper No: IMECE1997-1213

DOI: https://doi.org/10.1115/IMECE1997-1213

View Paper

Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments

Proceedings Papers

Natural Convection Heat Sink With Heated Shroud

Andrew T. Morrison, S. M. You

Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 83-88, November 16–21, 1997

Paper No: IMECE1997-1217

DOI: https://doi.org/10.1115/IMECE1997-1217

View Paper

Topics: Heat sinks, Natural convection, Heat, Stress, Boundary layers, Clearances (Engineering), Heat flux, Heat transfer, Laminar flow, Plates (structures)

Proceedings Papers

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

M. Gao, Y. Cao

Proc. ASME. IMECE98, Advanced Energy Systems, 503-508, November 15–20, 1998

Paper No: IMECE1998-0879

DOI: https://doi.org/10.1115/IMECE1998-0879

View Paper

Topics: Boiling, Electronics, Flat heat pipes, Heat transfer, Cooling, Fluids, Heat, Heat flux, Copper, Design

Proceedings Papers

Temperature Effect on Power MOSFET Devices

W. Lu, L. C. Chow, K. B. Sundaram

Proc. ASME. IMECE98, Advanced Energy Systems, 467-473, November 15–20, 1998

Paper No: IMECE1998-0875

DOI: https://doi.org/10.1115/IMECE1998-0875

View Paper

Topics: MOSFET transistors, Temperature, Thermal resistance, Junctions, Heat, Operating temperature, Cooling, Circuits, Heat sinks, Low temperature

Proceedings Papers

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Sanjeev B. Sathe, Bahgat G. Sammakia

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 747-756, November 15–20, 1998

Paper No: IMECE1998-1089

DOI: https://doi.org/10.1115/IMECE1998-1089

View Paper

Topics: Accounting, Adhesives, Ball-Grid-Array packaging, Construction, Convection, Design, Flat heat pipes, Geometry, Heat conduction, Heat sinks

Proceedings Papers

Evaluation of Hydraulic and Thermal Characteristics of Interconnected Parallel Flow Mini Heat Sink

Md Wasi Uddin, Hassan Shahriar Ayon, Tahmid Mohammad Mehrab, Najmus Saquib Sifat

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A056, November 1–5, 2021

Paper No: IMECE2021-71372

DOI: https://doi.org/10.1115/IMECE2021-71372

View Paper

Topics: Flow (Dynamics), Heat sinks

Proceedings Papers

Effect of Pore Size of Copper Foam on Thermal Performance of Bio-Based PCM/Copper Foam Composite

Yahya A. Sheikh, Mohamed Gadalla, Ahmed Azmeer

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A082, November 1–5, 2021

Paper No: IMECE2021-72299

DOI: https://doi.org/10.1115/IMECE2021-72299

View Paper

Topics: Composite materials, Copper, Heat sinks

Proceedings Papers

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Ozan Atalay, Murat Gultekin, Sertac Cadirci

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A055, November 1–5, 2021

Paper No: IMECE2021-70472

DOI: https://doi.org/10.1115/IMECE2021-70472

View Paper

Topics: Computational fluid dynamics, Heat sinks, Heat transfer, Design, Modeling, Convection, Cooling, Electric vehicles, Electronic components, Energy consumption

Proceedings Papers

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Hamid Fazeli

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A054, November 1–5, 2021

Paper No: IMECE2021-68217

DOI: https://doi.org/10.1115/IMECE2021-68217

View Paper

Topics: Genetic algorithms, Heat sinks, Microchannels, Nanofluids, Optimization, Water, Carbon nanotubes, Nanoparticles, Design, Thermal resistance

Proceedings Papers

Heat Sink Optimization for Collection of Potable Water Using Renewable Energy

Luz A. Amaya, David J. Broderick

Proc. ASME. IMECE2021, Volume 11: Heat Transfer and Thermal Engineering, V011T11A064, November 1–5, 2021

Paper No: IMECE2021-71477

DOI: https://doi.org/10.1115/IMECE2021-71477

View Paper

Topics: Heat sinks, Optimization, Renewable energy, Water, Thermoelectric cooling, Computational fluid dynamics, Condensation, Design, Natural disasters, Simulation

Proceedings Papers

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Bahgat Sammakia, Sanjeev Sathe

Proc. ASME. IMECE99, Electronics Manufacturing Issues, 121-138, November 14–19, 1999

Paper No: IMECE1999-0925

DOI: https://doi.org/10.1115/IMECE1999-0925

View Paper

Topics: Manufacturing, Heat sinks, Adhesives, Delamination, Design, Lamination, Signals, Stress, Accounting, Ball-Grid-Array packaging

NARROW

Potentials and Limitations of Concentrator Silicon Solar Cells Energy Utilization

Investigation of Mass Savings Potential of Zeolite Integrated Motor Thermal Management Systems in All-Electric Commercial Aircraft

Heat Transfer and Flow Characteristic of Sinusoidal Wavy Microchannel Heat Sink With Different Phase Shift

Electrohydrodynamic Conduction Pumping Driven Flow and Heat Transfer in a Flexible Minichannel

Experimental Investigation of Metallic Fibrous Heat Sinks for External Cooling of an Electronic Package

The Effect of Thermoelectric Cooler Mounting Orientation on Cooling Efficiency

Absorption Heat Pump Performance Improvement Through Ground Coupling

Contact Area and Thermal Contact Resistance in an Ideal Bolted Joint: Part 2 — Study of Thermal Contact Resistance

Characterisation of Open-Cell Aluminum Alloy Foams as Heat Sinks for High Power Electronic Devices

The Recommended Geometry for Laminar Microchannel Heat Sinks

Natural Convection Heat Sink With Heated Shroud

Heat Spreaders for High-Power Electronics Employing Boiling Mechanisms in a Narrow Space

Temperature Effect on Power MOSFET Devices

Some Aspects of the Thermal Performance of a Tape Ball Grid Array (TBGA) Package

Evaluation of Hydraulic and Thermal Characteristics of Interconnected Parallel Flow Mini Heat Sink

Effect of Pore Size of Copper Foam on Thermal Performance of Bio-Based PCM/Copper Foam Composite

Parametric Investigation on Thermal and Hydraulic Performance of Minichannel Heatsink

Multi-Objective Thermal Optimization of a Nanofluid-Cooled Rectangular Microchannel Heat Sink Using Genetic Algorithm: A Comparative Study

Heat Sink Optimization for Collection of Potable Water Using Renewable Energy

Thermal Issues That Arise due to Manufacturing Processes: Evaluation and Measurement Techniques

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only