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Proceedings Papers

Improving the Accuracy of Microscopic Laser Interferometry System for Precision Surface Measurement by Integrated Scanning Motions

Kee S. Moon, Yiding Wang

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 209-215, November 16–21, 1997

Paper No: IMECE1997-1094

DOI: https://doi.org/10.1115/IMECE1997-1094

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Topics: Interferometry, Lasers, Resolution (Optics), Computer simulation, Design, Diffraction patterns, Instrumentation, Magnification, Measurement systems, Surface texture

Proceedings Papers

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Jianjun Wang, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 411-421, November 16–21, 1997

Paper No: IMECE1997-1118

DOI: https://doi.org/10.1115/IMECE1997-1118

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Topics: Fracture toughness, Fracture (Materials), Temperature, Stress, Displacement, Finite element analysis, Interferometry, Molding, Silicon, Density

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

H. V. Tippur, H. Krishnamoorthy

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 77-84, November 16–21, 1997

Paper No: IMECE1997-1230

DOI: https://doi.org/10.1115/IMECE1997-1230

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Topics: Copper, Displacement, Fracture (Materials), Solders, Deformation, Fracture toughness, Interferometry, Strain gages

Proceedings Papers

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Xiaoyuan He, Daqing Zou, Sheng Liu, Yifan Guo

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 97-103, November 16–21, 1997

Paper No: IMECE1997-1233

DOI: https://doi.org/10.1115/IMECE1997-1233

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Topics: Interferometry, Displacement, Computer software, Phase diagrams, Computer programming, Deformation, Diffraction gratings, Electronic packages, Flip-chip

Proceedings Papers

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Daqing Zou, Xiaoyuan He, Sheng Liu, Yifan Guo, Fulong Dai

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 69-76, November 16–21, 1997

Paper No: IMECE1997-1229

DOI: https://doi.org/10.1115/IMECE1997-1229

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Topics: Corners (Structural elements), Deformation, Interferometry, Computer software, Electronic packaging, Failure, Flip-chip, Flip-chip packages, Image processing, Nanoscale phenomena

Proceedings Papers

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Daqing Zou, Jianjun Wang, Minfu Lu, Sheng Liu

Proc. ASME. IMECE97, Applications of Experimental Mechanics to Electronic Packaging, 51-57, November 16–21, 1997

Paper No: IMECE1997-1227

DOI: https://doi.org/10.1115/IMECE1997-1227

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Topics: Creep, Finite element methods, Finite element model, Interferometry, Modeling, Epoxy adhesives, Epoxy resins, Molding, Constitutive equations, Deformation

Proceedings Papers

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Jianjun Wang, Minfu Lu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 103-113, November 16–21, 1997

Paper No: IMECE1997-0505

DOI: https://doi.org/10.1115/IMECE1997-0505

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Topics: Flip-chip packages, Fracture (Materials), Stress, Crack propagation, Fracture toughness, Silicon chips, Deflection, Displacement, Interferometry, Density

Proceedings Papers

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

C. L. Chow, Fan Yang, H. Eliot Fang

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 223-233, November 16–21, 1997

Paper No: IMECE1997-0668

DOI: https://doi.org/10.1115/IMECE1997-0668

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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Fracture (Materials), Graphite, Damage, Failure, Fibers, Constitutive equations, Anisotropy

Proceedings Papers

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Qing Wang, Ming-Liang Du, Fu-Pen Chiang

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 459-465, November 16–21, 1997

Paper No: IMECE1997-0746

DOI: https://doi.org/10.1115/IMECE1997-0746

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Topics: Fracture (Materials), Micromechanics (Engineering), Steel, Stress, Fatigue, Deformation, Displacement, Carbon steel, Crack propagation, Cycles

Proceedings Papers

Electrostatic Mechanical Testing of Polysilicon

William N. Sharpe, Jr., Kevin Turner, Richard L. Edwards

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 385-388, November 15–20, 1998

Paper No: IMECE1998-1273

DOI: https://doi.org/10.1115/IMECE1998-1273

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Topics: Mechanical testing, Polysilicon, Brittleness, Cross section (Physics), Displacement, Interferometry, Lasers, Microelectromechanical systems, Tensile strength, Testing

Proceedings Papers

A Micromechanical Actuator With Capacitive Position Correction for Phase Shifting Diffraction Interferometry

Charles F. McConaghy, Abraham P. Lee, Gary Sommargren, Don Phillion, Eugene W. Campbell, Jimmy Trevino

Proc. ASME. IMECE98, Micro-Electro-Mechanical Systems (MEMS), 461-468, November 15–20, 1998

Paper No: IMECE1998-1285

DOI: https://doi.org/10.1115/IMECE1998-1285

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Topics: Actuators, Diffraction, Interferometry, Feedback, Circuits, Interferometers, Locks (Waterways), Metrology, Microactuators, Signals

Proceedings Papers

Crack Linkup at Multiple Site Damage

L. Ma, A. S. Kobayashi, S. N. Atluri, P. W. Tan

Proc. ASME. IMECE98, Recent Advances in Mechanics of Aerospace Structures and Materials, 1-2, November 15–20, 1998

Paper No: IMECE1998-0354

DOI: https://doi.org/10.1115/IMECE1998-0354

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Topics: Damage, Fracture (Materials), Stress, Collapse, Displacement, Aircraft, Aluminum, Design, Fasteners, Fatigue

Proceedings Papers

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Daqing Zou, Xiaoyuan He, Minfu Lu, Sheng Liu, Yifan Guo

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 59-64, November 15–20, 1998

Paper No: IMECE1998-0429

DOI: https://doi.org/10.1115/IMECE1998-0429

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Topics: Circuits, Control equipment, Corners (Structural elements), Deformation, Density, Displacement, Electronic packages, Flip-chip, Flip-chip packages, Interferometers

Proceedings Papers

Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method

D. S. Liu, S. C. Hsu, Y. C. Tung

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 51-58, November 15–20, 1998

Paper No: IMECE1998-0428

DOI: https://doi.org/10.1115/IMECE1998-0428

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Topics: Finite element methods, Thermal deformation, Finite element model, Testing, Computer simulation, Constitutive equations, Deformation, Design, Dimensions, Interferometry

Proceedings Papers

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

K. Verma, B. Han

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 93-99, November 15–20, 1998

Paper No: IMECE1998-0434

DOI: https://doi.org/10.1115/IMECE1998-0434

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Topics: Interferometry, Microelectronic devices, Warping, Surface roughness, Computers, Design for Manufacturing, Infrared radiation, Surface topography

Proceedings Papers

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Jianjun Wang, Daqing Zou, Zhengfang Qian, Wei Ren, Sheng Liu

Proc. ASME. IMECE98, Thermo-Mechanical Characterization of Evolving Packaging Materials and Structures, 35-42, November 15–20, 1998

Paper No: IMECE1998-0426

DOI: https://doi.org/10.1115/IMECE1998-0426

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Topics: Flip-chip packages, Manufacturing, Reliability, Solders, Simulation results, Finite element analysis, Finite element model, Interferometry, Warping, Contamination

Proceedings Papers

Transient Discharge of Entrained Air From a Wound Roll

M. B. Keshavan, J. A. Wickert

Proc. ASME. IMECE98, 9th International Symposium on Information Storage and Processing Systems, 41-50, November 15–20, 1998

Paper No: IMECE1998-0207

DOI: https://doi.org/10.1115/IMECE1998-0207

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Topics: Air entrainment, Transients (Dynamics), Winding (process), Air bearings, Interferometry, Lasers, Steady state, Surface roughness, Tension, Wedges

Proceedings Papers

Residual Stress Measurement in Spot Welds and the Effect of Fatigue Loading Using High Sensitivity Moire Interferometry

Sanjeev K. Khanna, Canlong He, Hari N. Agrawal

Proc. ASME. IMECE98, Recent Advances in Solids and Structures, 89-102, November 15–20, 1998

Paper No: IMECE1998-0890

DOI: https://doi.org/10.1115/IMECE1998-0890

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Topics: Fatigue, Interferometry, Stress, Welded joints, Low cycle fatigue, Steel sheet, Stress concentration

Proceedings Papers

Detection, Modelling, and Compensation of Geometric Errors in Coordinate Measuring Machines

Nael A. Barakat, Mohamed A. Elbestawi

Proc. ASME. IMECE98, Manufacturing Science and Engineering, 597-603, November 15–20, 1998

Paper No: IMECE1998-1073

DOI: https://doi.org/10.1115/IMECE1998-1073

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Topics: Coordinate measuring machines, Errors, Modeling, Kinematics, ASME Standards, Error compensation, Interferometry, Lasers, Performance evaluation, Simulation results

2 3 4 5

NARROW

Improving the Accuracy of Microscopic Laser Interferometry System for Precision Surface Measurement by Integrated Scanning Motions

Evaluation of Interfacial Fracture Toughness of a Bi-Material System Under Thermal Loading Conditions

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Measurement of Solder-Copper Interfacial Fracture Parameters Using u 2 -Displacement Fields

A Window Based Graphics Interface for Phase Shifting Analysis in Moire Interferometry

Resolving Deformation Field Near Corners and Interfaces by Phase Shifting Moiré Interferometry

Creep Behavior Study of Plastic Power Package by Real Time Moiré Interferometry and FEM Modeling

Investigation of Interfacial Fracture Behavior of a Flip-Chip Package Under a Constant Concentrated Load

Crack Initiation in Notched Unidirectional Graphite/Epoxy Composites

Micromechanics Study of Plastic Zone at Crack Tip in Steel Under Cyclic Load

Electrostatic Mechanical Testing of Polysilicon

A Micromechanical Actuator With Capacitive Position Correction for Phase Shifting Diffraction Interferometry

Crack Linkup at Multiple Site Damage

Refined Micro Moire System and its Applications to Chip Scale and Flip-Chip Packages

Thermal Deformation Analysis of a Plastic Quad Flat Package by Hybrid Moiré and Finite Element Method

Warpage Measurement of Microelectronics Devices by Far Infrared Fizeau Interferometry

Effect of Manufacturing Induced Defects on the Reliability of Flip-Chip Packages

Transient Discharge of Entrained Air From a Wound Roll

Residual Stress Measurement in Spot Welds and the Effect of Fatigue Loading Using High Sensitivity Moire Interferometry

Detection, Modelling, and Compensation of Geometric Errors in Coordinate Measuring Machines

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