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Proceedings Papers

Toolpath Planning With Thermal Stress Awareness for Material Extrusion Additive Manufacturing

Jayant Khatkar, Lee Clemon, Ramgopal Mettu

Proc. ASME. IMECE2022, Volume 2A: Advanced Manufacturing, V02AT02A013, October 30–November 3, 2022

Paper No: IMECE2022-94341

DOI: https://doi.org/10.1115/IMECE2022-94341

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Topics: Additive manufacturing, Extruding, Thermal stresses, Toolpaths

Proceedings Papers

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Yousuke Hisakuni, Akira Kano, Hideaki Uehara, Tomoko Monda, Junko Hirokawa, Osamu Nishimura, Kenji Hirohata, Toshinobu Ito, Shohei Takami, Kiyokazu Sato

Proc. ASME. IMECE2022, Volume 9: Mechanics of Solids, Structures, and Fluids; Micro- and Nano-Systems Engineering and Packaging; Safety Engineering, Risk, and Reliability Analysis; Research Posters, V009T14A029, October 30–November 3, 2022

Paper No: IMECE2022-94914

DOI: https://doi.org/10.1115/IMECE2022-94914

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Topics: Finite element analysis, Stress concentration, Wire, Crack propagation, Deformation, Resins, Acoustic emission testing, Damage, Electromagnetic force, Excitation

Proceedings Papers

Assessment of Chip-Scale Package Design Options

Sue Y. Teng, Yifan Guo, Vijay Sarihan

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 15-20, November 16–21, 1997

Paper No: IMECE1997-0811

DOI: https://doi.org/10.1115/IMECE1997-0811

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Topics: Design, Manufacturing, Simulation, Density, Equipment performance, Finite element analysis, Flip-chip, Shrinkage (Materials), Thermal stresses

Proceedings Papers

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

M. Uschitsky, E. Suhir, G. W. Kammlott

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 171-206, November 16–21, 1997

Paper No: IMECE1997-0819

DOI: https://doi.org/10.1115/IMECE1997-0819

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Topics: Composite materials, Molding, Thermoelasticity, Fillers (Materials), Thermal stresses, Epoxy adhesives, Epoxy resins, Design, Integrated circuits, Reliability

Proceedings Papers

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Y. Feng, V. R. Raju, E. Suhir

Proc. ASME. IMECE97, Structural Analysis in Microelectronics and Fiber Optics, 89-139, November 16–21, 1997

Paper No: IMECE1997-0817

DOI: https://doi.org/10.1115/IMECE1997-0817

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Topics: Failure, Adhesion, Fracture mechanics, Manufacturing, Mechanical behavior, Microelectronic devices, Modeling, Molding, Reliability, Surfaces (Materials)

Proceedings Papers

Thermal-Hydrologic-Mechanical Analyses of the In Situ Single Heater Test, Yucca Mountain, Nevada

Nicholas D. Francis, Steven R. Sobolik, Sanford Ballard

Proc. ASME. IMECE97, Fluids Engineering, 445-456, November 16–21, 1997

Paper No: IMECE1997-0802

DOI: https://doi.org/10.1115/IMECE1997-0802

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Topics: Computers, Convection, Displacement measurement, Engineering simulation, Finite element analysis, Heat, Heating and cooling, Permeability, Rocks, Simulation

Proceedings Papers

Influence of the Clamping Mechanism on Tool Failure During Dry High Speed Machining

Tahany I. El-Wardany, Mohamed A. Elbestawi

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 2, 285-296, November 16–21, 1997

Paper No: IMECE1997-1164

DOI: https://doi.org/10.1115/IMECE1997-1164

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Topics: Failure, High speed machining, Brittle fracture, Tension, Aluminum, Automotive brakes, Boron, Cast iron, Clamps (Tools), Composite materials

Proceedings Papers

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Jiansen Zhu, Daqing Zou, Sheng Liu

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 361-368, November 16–21, 1997

Paper No: IMECE1997-1111

DOI: https://doi.org/10.1115/IMECE1997-1111

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Topics: Simulation, Thermal deformation, Temperature, Finite element analysis, Interferometry, Diffraction patterns, Electronic packaging, Packaging, Reliability, Diffraction gratings

Proceedings Papers

Stress Analysis of High Density Bare Chip Packaging Technologies

Yutaka Tsukada, Shogo Mizumoto, Yasuyuki Kodama, Hideo Nishimura

Proc. ASME. IMECE97, Application of Fracture Mechanics in Electronic Packaging, 49-50, November 16–21, 1997

Paper No: IMECE1997-0499

DOI: https://doi.org/10.1115/IMECE1997-0499

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Topics: Density, Packaging, Stress analysis (Engineering), Epoxy adhesives, Epoxy resins, Ceramics, Ball-Grid-Array packages, Ball-Grid-Array packaging, Electronic packaging, Flip-chip

Proceedings Papers

Evaluation of Transverse Thermal Stresses in Composite Plates Based on First-Order Shear Deformation Theory

R. Rolfes, A. K. Noor, H. Sparr

Proc. ASME. IMECE97, Recent Advances in Solids/Structures and Application of Metallic Materials, 167-184, November 16–21, 1997

Paper No: IMECE1997-0533

DOI: https://doi.org/10.1115/IMECE1997-0533

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Topics: Composite materials, Plates (structures), Shear deformation, Thermal stresses, Finite element analysis, Shear (Mechanics), Stress, Displacement, Finite element model, Laminates

Proceedings Papers

Plasma Spraying of Functionally Graded NiCoCrAlY/Yttria Stabilized ZrO 2 Coatings Using Composite Powders

K. A. Khor, Y. W. Gu, Z. L. Dong, T. S. Srivatsan

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 89-105, November 16–21, 1997

Paper No: IMECE1997-0654

DOI: https://doi.org/10.1115/IMECE1997-0654

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Topics: Coatings, Composite materials, Plasma spraying, Bond strength, Density, Diffusion (Physics), Feedstock, Heat, Hot isostatic presses, Microhardness

Proceedings Papers

Mechanics of Polymeric Composites Exposed to a Constant Heat Flux

Mark E. Tuttle, Ann M. Mescher, Mark L. Potocki

Proc. ASME. IMECE97, Composites and Functionally Graded Materials, 157-164, November 16–21, 1997

Paper No: IMECE1997-0660

DOI: https://doi.org/10.1115/IMECE1997-0660

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Topics: Heat flux, Polymer composites, Composite materials, Fire, Glass, Polyester fabrics, Pyrolysis, Temperature gradient, Tension, Thermal stresses

Proceedings Papers

Prediction of First Ply Failure in Scaled Cross-Ply Composite Laminates

Karen E. Jackson

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 11-21, November 16–21, 1997

Paper No: IMECE1997-0705

DOI: https://doi.org/10.1115/IMECE1997-0705

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Topics: Composite materials, Failure, Laminates, Stress, Tension, Acoustic emissions, Dimensions, Epoxy adhesives, Epoxy resins, Failure analysis

Proceedings Papers

Thermal Stresses in a Layer due to a Train of Laser Pulses

Richard B. Hetnarski, Louis G. Hector, Jr., Woo-Seung Kim

Proc. ASME. IMECE97, Analysis and Design Issues for Modern Aerospace Vehicles, 101-106, November 16–21, 1997

Paper No: IMECE1997-0713

DOI: https://doi.org/10.1115/IMECE1997-0713

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Topics: Lasers, Thermal stresses, Trains, Thermoelasticity, Gaussian distribution, Radiation (Physics), Stress

Proceedings Papers

Thermal Properties of Honeycomb Panels: Analysis of Transient Experiments With One-Dimensional Models

Kevin D. Cole

Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 83-93, November 15–20, 1998

Paper No: IMECE1998-0725

DOI: https://doi.org/10.1115/IMECE1998-0725

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Topics: Honeycomb structures, Thermal properties, Transients (Dynamics), Thermal conductivity, Aircraft, Heat transfer, Parameter estimation, Structural elements (Construction), Thermal stresses, Titanium

Proceedings Papers

Numerical Estimation of Heat Transfer and Thermal Stresses in Water Cooling of Shipbuilding Profiles

Karstein Sørli, Vigdis Olden

Proc. ASME. IMECE98, Heat Transfer: Volume 5 — Numerical and Experimental Methods in Heat Transfer, 183-190, November 15–20, 1998

Paper No: IMECE1998-0734

DOI: https://doi.org/10.1115/IMECE1998-0734

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Topics: Cooling, Heat transfer, Shipbuilding, Thermal stresses, Water, Heat transfer coefficients, Computer software, Temperature measurement, Time series

Proceedings Papers

The Effect of Spatially Nonuniform Thermal Fields on the Vibration Frequencies of EDM Wires

Kevin D. Murphy, Zhengmao Lin

Proc. ASME. IMECE98, Dynamics, Acoustics and Simulations, 227-234, November 15–20, 1998

Paper No: IMECE1998-0571

DOI: https://doi.org/10.1115/IMECE1998-0571

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Topics: Electrical discharge machining, Oscillating frequencies, Wire, Temperature, Bifurcation, Buckling, Convection, Eigenvalues, Electrodes, Energy storage

Proceedings Papers

Supraphysiological Thermal Injury in Dunning AT-1 Prostate Tumor Cells

Sankha Bhowmick, John C. Bischof

Proc. ASME. IMECE98, Advances in Heat and Mass Transfer in Biotechnology, 77-78, November 15–20, 1998

Paper No: IMECE1998-0798

DOI: https://doi.org/10.1115/IMECE1998-0798

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Topics: Tumors, Wounds, Damage, Membranes, Biological tissues, Temperature, Assaying, Cancer, Dynamics (Mechanics), Leakage

Proceedings Papers

Dynamic Optimization of Start-up and Load-Increasing Processes in Power Plants: Methodology and Application

Jens Bausa, George Tsatsaronis

Proc. ASME. IMECE98, Advanced Energy Systems, 165-173, November 15–20, 1998

Paper No: IMECE1998-0840

DOI: https://doi.org/10.1115/IMECE1998-0840

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Topics: Optimization, Power stations, Stress, Algebra, Boilers, Combined cycle power stations, Differential equations, Fuel consumption, Pipes, Pressure

Proceedings Papers

A Novel Compatibility/ Equilibrium Based Iterative Post-Processing Approach for Axisymmetric Brittle Matrix Composites

R. A. Chaudhuri, N. J. Pagano, G. P. Tandon, A. H. Khan

Proc. ASME. IMECE98, Mechanical Behavior of Advanced Materials, 169, November 15–20, 1998

Paper No: IMECE1998-1159

DOI: https://doi.org/10.1115/IMECE1998-1159

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Topics: Brittleness, Composite materials, Equilibrium (Physics), Stress, Cylinders, Displacement, Fibers, Potential energy, Stress concentration, Theorems (Mathematics)

NARROW

Toolpath Planning With Thermal Stress Awareness for Material Extrusion Additive Manufacturing

Stress Concentration Mechanism in Superconducting Coil Quench Phenomenon by Large-Scale Finite Element Analysis

Assessment of Chip-Scale Package Design Options

Thermoelastic Behavior of Filled Molding Compounds: Composite Mechanics Approach

Moisture Induced Failures of Plastic Packages of IC Devices: State-of-the-Art and Crucial Needs

Thermal-Hydrologic-Mechanical Analyses of the In Situ Single Heater Test, Yucca Mountain, Nevada

Influence of the Clamping Mechanism on Tool Failure During Dry High Speed Machining

Real Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Stress Analysis of High Density Bare Chip Packaging Technologies

Evaluation of Transverse Thermal Stresses in Composite Plates Based on First-Order Shear Deformation Theory

Plasma Spraying of Functionally Graded NiCoCrAlY/Yttria Stabilized ZrO 2 Coatings Using Composite Powders

Mechanics of Polymeric Composites Exposed to a Constant Heat Flux

Prediction of First Ply Failure in Scaled Cross-Ply Composite Laminates

Thermal Stresses in a Layer due to a Train of Laser Pulses

Thermal Properties of Honeycomb Panels: Analysis of Transient Experiments With One-Dimensional Models

Numerical Estimation of Heat Transfer and Thermal Stresses in Water Cooling of Shipbuilding Profiles

The Effect of Spatially Nonuniform Thermal Fields on the Vibration Frequencies of EDM Wires

Supraphysiological Thermal Injury in Dunning AT-1 Prostate Tumor Cells

Dynamic Optimization of Start-up and Load-Increasing Processes in Power Plants: Methodology and Application

A Novel Compatibility/ Equilibrium Based Iterative Post-Processing Approach for Axisymmetric Brittle Matrix Composites

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