Topics: Bolted joints, Contact resistance, Plates (structures), Separation (Technology), Calibration, Equations, Finishes, Finite element methods, Materials properties, Metals

Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability

Topics: Bolted joints, Contact resistance, Plates (structures), Boundary-value problems, Copper, Pressure, Cooling, Design, Finishes, Geometry

Topics: Thermomechanics, Design, Arches, Computer programming, Electrical wires, Geometry, Manufacturing, Mentoring, Product design, Thrust

Topics: Automotive industry, Ball-Grid-Array packaging, Temperature, Junctions, Printed circuit boards, Computational fluid dynamics, Thermal conductivity, Heat transfer, Transients (Dynamics), Energy dissipation

Topics: Aluminum alloys, Foams (Chemistry), Heat sinks, Cross-flow, Cylinders, Dimensions, Fluid dynamics, Fluids, Heat transfer coefficients, Pressure drop

Topics: Geometry, Heat sinks, Microchannels, Design, Coolants, Cooling, Heat flux, Heat transfer, Integrated circuits, Optical instruments

Topics: Electronic equipment, Thermal analysis, Transients (Dynamics), Temperature, Cycles, Design, Electronic components, Flow (Dynamics), Junctions, Reliability

Topics: Automotive brakes, Temperature, Brakes, Braking, Fluids, Boiling, Disks, Vehicles, Energy dissipation, Failure

Topics: Solders, Thermomechanics, Ceramics, Cracking (Materials), Cycles, Design, Energy dissipation, Fatigue life, Finite element methods, Finite element model

Topics: Heat sinks, Natural convection, Heat, Stress, Boundary layers, Clearances (Engineering), Heat flux, Heat transfer, Laminar flow, Plates (structures)

Topics: Electronic packaging, Manufacturing, Printed circuit boards, Product quality, Warping, Ovens, Economics , Materials properties, Temperature, Thermomechanics