In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved equivalent model for the use in the local/global analysis, and most importantly, provide a systematic procedure in approaching this equivalent model. In addition, the choice of the equivalent beam model will also be extensively investigated. Since the configuration of the solder joint is far from being close to a “beam-like” structure, defining the corresponding equivalent beam involves great levels of difficulties. In order to remove the possible difficulties, an effective way is proposed: incorporating analytical derivations and optimization. To this end, one practical application is presented to substantiate the proposed methodology.
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e-mail: c00hcc00@nchc.gov.tw
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June 1998
Special Section Technical Papers
An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages
H. C. Cheng,
H. C. Cheng
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
e-mail: c00hcc00@nchc.gov.tw
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K. N. Chiang,
K. N. Chiang
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
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M. H. Lee
M. H. Lee
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
Search for other works by this author on:
H. C. Cheng
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
e-mail: c00hcc00@nchc.gov.tw
K. N. Chiang
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
M. H. Lee
Computational Solid Mechanics Laboratory, National Center for High-Performance Computing, P.O. Box 19-136, Hsinchu, Taiwan, R. O. C.
J. Electron. Packag. Jun 1998, 120(2): 129-134 (6 pages)
Published Online: June 1, 1998
Article history
Received:
December 21, 1997
Revised:
January 29, 1998
Online:
November 6, 2007
Citation
Cheng, H. C., Chiang, K. N., and Lee, M. H. (June 1, 1998). "An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages." ASME. J. Electron. Packag. June 1998; 120(2): 129–134. https://doi.org/10.1115/1.2792597
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