An experimental study of forced convection in impinging flow, using fluorocarbon FX3250 and a simulated electronic chip, was performed. A test section consisting of a 35 mm long, 1 mm wide slot nozzle in a 2 mm thick plate offset 2 mm from the heat source was used. The simulated chip array consisted of five foil strip (4 mm wide) heaters, positioned with the center strip directly beneath the slot nozzle. The velocity of the coolant was varied from 0.53 to 5 m/s, and the subcooling in the range from 2 to 21 K. The experiments were conducted focusing on two cases. First, only the center strip was heated. Second, all the heaters were energized, and the strip-by-strip variations of heat transfer were measured. The critical heat flux (CHF) on the center strip, determined by sensing the onset of oscillations and subsequent rapid rise of foil temperatures, was found considerably lower than those predicted by the existing correlations. It is pointed out that the thermal mass of the test heater could be an important factor for the CHF. The heat transfer behavior of other strips showed channel-flow or jet-impingement mode depending on the strip location and the coolant flow rate. [S1043-7398(00)00202-4]
Skip Nav Destination
Article navigation
June 2000
Technical Papers
Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array
Wataru Nakayama,
Wataru Nakayama
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
11
Search for other works by this author on:
Masud Behnia,
Masud Behnia
School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australia
Search for other works by this author on:
Hiroaki Mishima
Hiroaki Mishima
Department of Mechanical and Intelligent Systems Engineering, Tokyo Institute of Technology, Oh-okayama, Meguro, Tokyo, Japan
Search for other works by this author on:
Wataru Nakayama
11
CALCE Electronic Packaging Research Center, University of Maryland, College Park, MD 20742
Masud Behnia
School of Mechanical and Manufacturing Engineering, University of New South Wales, Sydney, NSW 2052, Australia
Hiroaki Mishima
Department of Mechanical and Intelligent Systems Engineering, Tokyo Institute of Technology, Oh-okayama, Meguro, Tokyo, Japan
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD November 11, 1998; revision received Feb. 18, 2000. Associate Technical Editor: A. Ortega.
J. Electron. Packag. Jun 2000, 122(2): 132-137 (6 pages)
Published Online: February 18, 2000
Article history
Received:
November 11, 1998
Revised:
February 18, 2000
Citation
Nakayama, W., Behnia, M., and Mishima, H. (February 18, 2000). "Impinging Jet Boiling of a Fluorinert Liquid on a Foil Heater Array ." ASME. J. Electron. Packag. June 2000; 122(2): 132–137. https://doi.org/10.1115/1.483145
Download citation file:
Get Email Alerts
Cited By
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag
Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
J. Electron. Packag
Related Articles
A Vapotron Effect Application for Electronic Equipment Cooling
J. Electron. Packag (December,2003)
Heat Transfer From a Small Heated Region to R-113 and FC-72
J. Heat Transfer (November,1989)
Single- and Two-Phase Convective Heat Transfer From Smooth and Enhanced Microelectronic Heat Sources in a Rectangular Channel
J. Heat Transfer (November,1989)
Single-Phase and Two-Phase Hybrid Cooling Schemes for High-Heat-Flux Thermal Management of Defense Electronics
J. Electron. Packag (June,2009)
Related Proceedings Papers
Related Chapters
Forced Convection Subcooled Boiling
Two-Phase Heat Transfer
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment