Solder bridging is one of the most serious defects of solder joint in fine pitch device assemblies. It is known that the generation of solder bridging is closely related to the forming process of solder joints. To simulate the process, a 3D model is formed. Then it is numerically simulated using Surface Evolver program. Based on the results, the solder bridging mechanism and the effective factors including wetting angle and surface tension are investigated.
Issue Section:
Technical Papers
1.
Gao
, Y. X.
, Fan
, H.
, and Xiao
, Z.
, 2000
, “A Thermodynamics Model for Solder Profile Evolution
,” Acta Mater.
, 48
, pp. 863
–874
.2.
Conway
, P. P.
, Kalantary
, M. R.
, and Williams
, D. J.
, 1996
, “Experimental Investigation of the Formation of Surface Mount Solder Joints
,” ASME J. Electron. Packag.
, 118
(4
), pp. 223
–228
.3.
Heinrich
, S. M.
, and Lee
, P. S.
, 1997
, “Solder Geometry Prediction in Electronic Packaging: An Overview
,” Advances in Electronic Packaging
, 19
(2
), pp. 1371
–1376
.4.
Brake, K. A., 1998, “Surface Evolver Manual,” Version 2.10, The Geometry Center, University of Minnesota, Minneapolis.
5.
Wang
, G. Z.
, Chen
, Z. N.
, and Wang
, C. Q.
, 1998
, “Computer Simulation of Three Dimensional Castellated Solder Joint Geometry in Surface Mount Technology
,” Modell. Simul. Mater. Sci. Eng.
, 6
, pp. 557
–567
.6.
Zhao
, X. J.
, and Wang
, C. Q.
, 2000
, “An Integrated System for Prediction and Analysis of Solder Interconnection Shapes
,” IEEE Transaction on Electronics Packaging Manufacturing
, 23
(2
), pp. 87
–91
.7.
Li
, M. Y.
, Wang
, C. Q.
, and Zhang
, L.
, 2001
, “Solder Bridge Mechanism in Surface Mount Technology
,” Prog. Nat. Sci.
, 11
(3
), pp. 221
–225
.Copyright © 2004
by ASME
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