Abstract

With the increase of electronic device power density, thermal management and reliability are increasingly critical in the design of power electronic systems. First, increased density challenges the capability of conventional heat sinks to adequately dissipate heat. Second, higher frequency switching in high voltage, high current, wide bandgap power modules is creating intensified electromagnetic interference (EMI) challenges, in which metallic heat removal systems will couple and create damaging current ringing. Furthermore, mobile power systems require lightweight heat removal methods that satisfy the heat loads dissipated during operation. In this effort, we introduce an additive manufacturing (AM) pathway to produce custom heat removal systems using nonmetallic materials, which take advantage of impinging fluid heat transfer to enable efficient thermal management. Herein, we leverage the precision of additive manufacturing techniques in the development of three-dimensional optimized flow channels for achieving enhanced effective convective heat transfer coefficients. The experimental performance of convective heat removal due to liquid impingement is compared with conventional heat sinks, with the requirement of simulating the heat transfer needed by a high voltage inverter. The implementation of nonmetallic materials manufacturing is aimed to reduce electromagnetic interference in a low weight and reduced cost package, making it useful for mobile power electronics.

References

References
1.
Sharar
,
D.
,
Jankowski
,
N.
, and
Morgan
,
B.
,
2010
, “Review of Two-Phase Electronics Cooling for Army Vehicle Applications,” U.S. Army Research Laboratory, Adelphi, MD, Report No.
ARL-TR-5323
.https://www.researchgate.net/publication/235203410_Review_of_Two-phase_Electronics_Cooling_for_Army_Vehicle_Applications
2.
Hirshfeld
,
H.
,
Silverman
,
I.
,
Arenshtam
,
A.
,
Kijel
,
D.
, and
Nagler
,
A.
,
2006
, “
High Heat Flux Cooling of Accelerator Targets With Micro-Channels
,”
Nucl. Instrum. Methods Phys. Res. Sect. A
,
562
(
2
), pp.
903
905
.10.1016/j.nima.2006.02.104
3.
Pais
,
M. R.
,
Chow
,
L. C.
, and
Mahefkey
,
E. T.
,
1992
, “
Surface Roughness and Its Effects on the Heat Transfer Mechanism in Spray Cooling
,”
ASME J. Heat Transfer
,
114
(
1
), pp.
211
219
.10.1115/1.2911248
4.
Jambunathan
,
K.
,
Lai
,
E.
,
Moss
,
M. A.
, and
Button
,
B. L.
,
1992
, “
A Review of Heat Transfer Data for Single Circular Jet Impingement
,”
Int. J. Heat Fluid Flow
,
13
(
2
), pp.
106
115
.10.1016/0142-727X(92)90017-4
5.
Huber
,
A. M.
, and
Viskanta
,
R.
,
1994
, “
Effect of Jet-Jet Spacing on Convective Heat Transfer to Confined, Impinging Arrays of Axisymmetric Air Jets
,”
Int. J. Heat Mass Transfer
,
37
(
18
), pp.
2859
2869
.10.1016/0017-9310(94)90340-9
6.
San
,
J. Y.
,
Huang
,
C. H.
, and
Shu
,
M. H.
,
1997
, “
Impingement Cooling of a Confined Circular Air Jet
,”
Int. J. Heat Mass Transfer
,
40
(
6
), pp.
1355
1364
.10.1016/S0017-9310(96)00201-3
7.
Wei
,
T.
,
Oprins
,
H.
,
Cherman
,
V.
,
Qian
,
J.
,
Wolf
,
I. D.
,
Beyne
,
E.
, and
Baelmans
,
M.
,
2019
, “
High-Efficiency Polymer-Based Direct Multi-Jet Impingement Cooling Solution for High-Power Devices
,”
IEEE Trans. Power Electron.
,
34
(
7
), pp.
6601
6612
.10.1109/TPEL.2018.2872904
8.
Dupuis
,
P.
,
Cormier
,
Y.
,
Fenech
,
M.
, and
Jodoin
,
B.
,
2016
, “
Heat Transfer and Flow Structure Characterization for Pin Fins Produced by Cold Spray Additive Manufacturing
,”
Int. J. Heat Mass Transfer
,
98
, pp.
650
661
.10.1016/j.ijheatmasstransfer.2016.03.069
9.
Dede
,
E. M.
,
Joshi
,
S. N.
, and
Zhou
,
F.
,
2015
, “
Topology Optimization, Additive Layer Manufacturing, and Experimental Testing of an Air-Cooled Heat Sink
,”
ASME J. Mech. Des.
,
137
(
11
), p.
111403
.10.1115/1.4030989
10.
Wong
,
M.
,
Owen
,
I.
, and
Sutcliffe
,
C. J.
,
2009
, “
Pressure Loss and Heat Transfer Through Heat Sinks Produced by Selective Laser Melting
,”
Heat Transfer Eng.
,
30
(
13
), pp.
1068
1076
.10.1080/01457630902922228
11.
Whitt
,
R.
,
Nafis
,
B.
,
Huitink
,
D.
,
Yuan
,
Z.
,
Deshpande
,
A.
,
Narayanasamy
,
B.
, and
Luo
,
F.
,
2019
, “
Heat Transfer and Pressure Drop Performance of Additively Manufactured Polymer Heat Spreaders for Low-Weight Directed Cooling Integration in Power Electronics
,” 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (
ITherm
), Las Vegas, NV, May 28–31, pp.
451
455
.10.1109/ITHERM.2019.8757275
12.
Whitt
,
R.
, and
Huitink
,
D.
,
2019
, “
Thermal Validations of Additive Manufactured Non-Metallic Heat Spreading Device for Hot Spot Mitigation in Power Modules
,”
Int. Symp. Microelectron. Fall
,
2019
(
1
), pp.
000398
000403
.10.4071/2380-4505-2019.1.000398
You do not currently have access to this content.