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Journal Articles

Leadfree Sac Solder Materials Characterization At High Strain Rates At Low Test Temperatures And Drop & Shock Simulation Using Input-G Method

Accepted Manuscript
Pradeep Lall, Vikas Yadav, Jeffrey C. Suhling, David Locker
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: June 29, 2023
View Article titled, Leadfree Sac Solder Materials Characterization At High Strain Rates At Low Test Temperatures And Drop & Shock Simulation Using Input-G Method
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Topics: Materials characterization, Shock (Mechanics), Simulation, Solders, Temperature, Alloys, Storage, Damage, Lead-free solders, Aircraft
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Article Type: Research-Article
Publisher: ASME
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

IGBT Package Design for High Power Aircraft Electronic Systems

Farhad Sarvar, David C. Whalley, Ming K. Low
Journal: Journal of Electronic Packaging
Article Type: Special Section On Therminic
J. Electron. Packag. December 2001, 123(4): 338–343.
https://doi.org/10.1115/1.1390341
Published Online: September 3, 2001
View Article titled, IGBT Package Design for High Power Aircraft Electronic Systems
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Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft
Journal Articles

Avionics Passive Cooling With Microencapsulated Phase Change Materials

A. J. Fossett, M. T. Maguire, A. A. Kudirka, F. E. Mills, D. A. Brown
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 238–242.
https://doi.org/10.1115/1.2792628
Published Online: September 1, 1998
View Article titled, Avionics Passive Cooling With Microencapsulated Phase Change Materials
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Topics: Avionics, Cooling, Phase change materials, Aircraft, Aluminum plate, Design, Heat sinks, Missiles, Weight (Mass)
Journal Articles

A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics

Peter E. Jimenez, Issam Mudawar
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 220–229.
https://doi.org/10.1115/1.2905689
Published Online: September 1, 1994
View Article titled, A Multi-Kilowatt Immersion-Cooled Standard Electronic Clamshell Module for Future Aircraft Avionics
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Topics: Aircraft, Avionics, Coolants, Flow (Dynamics), Pressure drop, Subcooling, Cooling, Heat, Military systems, Printed circuit boards