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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

M. G. D. Geers, V. Kouznetsova, W. A. M. Brekelmans

J. Electron. Packag. September 2005, 127(3): 255–261.

DOI: https://doi.org/10.1115/1.1939007

Published Online: June 24, 2004

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Topics: Continuum mechanics, Deformation, Dislocations, Lumber, Microelectronic devices, Plasticity, Strain gradient, Boundary-value problems, Metals, Stress

Journal Articles

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Sung Yi, Guangxing Luo, Kerm Sin Chian

J. Electron. Packag. June 2002, 124(2): 91–96.

DOI: https://doi.org/10.1115/1.1451845

Published Online: May 2, 2002

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Topics: Constitutive equations, Creep, Deformation, Dislocations, Grain boundaries, Grain size, Solders, Stress tensors, Temperature

Journal Articles

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Z. Guo, Yi-Hsin Pao, H. Conrad

J. Electron. Packag. June 1995, 117(2): 100–104.

DOI: https://doi.org/10.1115/1.2792074

Published Online: June 1, 1995

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Topics: Deformation, Solder joints, Temperature, Shear rate, Shear stress, Creep, Diffusion (Physics), Dislocations, Grain size, High temperature

Journal Articles

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Q. Guo, E. C. Cutiongco, L. M. Keer, M. E. Fine

J. Electron. Packag. June 1992, 114(2): 145–151.

DOI: https://doi.org/10.1115/1.2906411

Published Online: June 1, 1992

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Topics: Fatigue life, Solders, Thermomechanics, Failure, Fatigue testing, Cycles, Fatigue, Compressive stress, Dislocations, Stress

Journal Articles

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Z. Guo, A. F. Sprecher, H. Conrad

J. Electron. Packag. June 1992, 114(2): 112–117.

DOI: https://doi.org/10.1115/1.2906406

Published Online: June 1, 1992

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Topics: Deformation, Low cycle fatigue, Solder joints, Tin, Stress, Alloys, Dislocations, Shear (Mechanics)

Journal Articles

Superplastic Creep of Eutectic Tin-Lead Solder Joints

Z. Mei, J. W. Morris, Jr., M. C. Shine

J. Electron. Packag. June 1991, 113(2): 109–114.

DOI: https://doi.org/10.1115/1.2905375

Published Online: June 1, 1991

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Topics: Creep, Solder joints, Superplasticity, Stress, Cooling, Dislocations, Grain boundaries, Nitrogen, Recrystallization, Steady state

Journal Articles

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

Yoshiki Oshida, P. C. Chen

J. Electron. Packag. March 1991, 113(1): 58–62.

DOI: https://doi.org/10.1115/1.2905367

Published Online: March 1, 1991

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Topics: Cycles, Damage, Dislocation density, Dislocations, Fatigue, Fatigue failure, Fatigue life, Fracture (Materials), Low cycle fatigue, Metallic thin films

Journal citation

NARROW

Effective Constitutive Relations for Sintered Nano Copper Joints

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Multiscale Mechanics in Microelectronics: A Paradigm in Miniaturization

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Plastic Deformation Kinetics of 95.5Sn4Cu0.5Ag Solder Joints

Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder

Plastic Deformation Kinetics of Eutectic Pb-Sn Solder Joints in Monotonic Loading and Low-Cycle Fatigue

Superplastic Creep of Eutectic Tin-Lead Solder Joints

High and Low-Cycle Fatigue Damage Evaluation of Multilayer Thin Film Structure

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