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Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Accepted Manuscript
Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1063
DOI: https://doi.org/10.1115/1.4062530
Published Online: May 15, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Cooling, Simulation, Computer software, Convection, Cooling systems, Energy conservation, Finite element analysis, Finite element methods, Hardware, Heat
Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
DOI: https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
View Article titled, A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Click here to open pdf in another window PDF for A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging
Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging
Journal Articles

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen
Journal: Journal of Electronic Packaging
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 175–178.
DOI: https://doi.org/10.1115/1.2792616
Published Online: June 1, 1998
View Article titled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
Click here to open pdf in another window PDF for Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array
Topics: Ball-Grid-Array packaging, Electronic packaging, Shapes, Solder masks, Solder joints, Density, Energy conservation, Failure, Fatigue, Gravity (Force)
Journal Articles

Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling

Elias Papanicolaou, Sridhar Gopalakrishna
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 307–316.
DOI: https://doi.org/10.1115/1.2792110
Published Online: December 1, 1995
View Article titled, Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling
Click here to open pdf in another window PDF for Natural Convection in Shallow, Horizontal Air Layers Encountered in Electronic Cooling
Topics: Computer cooling, Natural convection, Convection, Heat transfer, Cooling, Dimensions, Energy conservation, Heat conduction, Heat flux, Heating
Journal Articles

Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint

S. K. Patra, Y. C. Lee
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 1991, 113(4): 337–342.
DOI: https://doi.org/10.1115/1.2905417
Published Online: December 1, 1991
View Article titled, Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
Click here to open pdf in another window PDF for Quasi-Static Modeling of the Self-Alignment Mechanism in Flip-Chip Soldering—Part I: Single Solder Joint
Topics: Flip-chip, Modeling, Solder joints, Soldering, Solders, Energy conservation, Manufacturing, Reflow soldering, Reliability, Stress