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Journal Articles

The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch

Justin H. Chow, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041104.
Paper No: EP-23-1035
https://doi.org/10.1115/1.4063485
Published Online: October 9, 2023
View Article titled, The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch
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Topics: Inks, Particulate matter, Percolation theory, Resistors, Silver, Modeling
Journal Articles

Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure

Zong-Tao Li, Jun-Hao Wu, Guan-Wei Liang, Ren-peng Yang, Zhihui Yang, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011001.
Paper No: EP-22-1071
https://doi.org/10.1115/1.4062383
Published Online: May 2, 2023
View Article titled, Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure
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Topics: Columns (Structural), Particulate matter, Reflectance
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011104.
Paper No: EP-22-1019
https://doi.org/10.1115/1.4055841
Published Online: October 22, 2022
View Article titled, Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids
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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature
Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. June 2022, 144(2): 024501.
Paper No: EP-21-1070
https://doi.org/10.1115/1.4053363
Published Online: January 28, 2022
View Article titled, Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics
Open the PDF for Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics in another window
Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow
Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031009.
Paper No: EP-21-1076
https://doi.org/10.1115/1.4051728
Published Online: September 15, 2021
View Article titled, Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds
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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper
Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2022, 144(3): 030801.
Paper No: EP-20-1054
https://doi.org/10.1115/1.4051255
Published Online: September 15, 2021
View Article titled, Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review
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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure
Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011007.
Paper No: EP-20-1120
https://doi.org/10.1115/1.4050871
Published Online: August 6, 2021
View Article titled, Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds
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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength
Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041005.
Paper No: EP-20-1011
https://doi.org/10.1115/1.4048729
Published Online: October 28, 2020
View Article titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Optimization, Network models
Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041103.
Paper No: EP-19-1096
https://doi.org/10.1115/1.4047469
Published Online: June 23, 2020
View Article titled, Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization
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Topics: Data centers, Dust, Leakage, Particulate matter, Sensors
Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031109.
Paper No: EP-20-1009
https://doi.org/10.1115/1.4046935
Published Online: May 4, 2020
View Article titled, Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications
Open the PDF for Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications in another window
Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat
Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2020, 142(3): 031101.
Paper No: EP-19-1109
https://doi.org/10.1115/1.4046763
Published Online: April 17, 2020
View Article titled, High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting
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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum
Journal Articles

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031003.
Paper No: EP-18-1103
https://doi.org/10.1115/1.4043481
Published Online: May 8, 2019
View Article titled, Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization
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Topics: Data centers, Fourier transform infrared spectroscopy, Particulate matter, Scanning electron microscopy, Contamination, Dust
Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031005.
Paper No: EP-18-1076
https://doi.org/10.1115/1.4042982
Published Online: April 10, 2019
View Article titled, Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging
Open the PDF for Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging in another window
Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy
Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031006.
Paper No: EP-17-1110
https://doi.org/10.1115/1.4040204
Published Online: June 11, 2018
View Article titled, Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density
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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver
Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2018, 140(2): 020901.
Paper No: EP-17-1092
https://doi.org/10.1115/1.4039136
Published Online: May 9, 2018
View Article titled, Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model
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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties
Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031003.
Paper No: EP-16-1108
https://doi.org/10.1115/1.4036066
Published Online: June 14, 2017
View Article titled, Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes
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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission
Journal Articles

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2017, 139(2): 020903.
Paper No: EP-16-1143
https://doi.org/10.1115/1.4036363
Published Online: April 24, 2017
View Article titled, Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope
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Topics: Contamination, Corrosion, Data centers, Particulate matter, Temperature, Cooling, Reliability, Damage, Failure
Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041009.
Paper No: EP-16-1090
https://doi.org/10.1115/1.4034927
Published Online: October 21, 2016
View Article titled, Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks
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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles
Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2016, 138(4): 041007.
Paper No: EP-16-1051
https://doi.org/10.1115/1.4034854
Published Online: October 20, 2016
View Article titled, Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module
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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling