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Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen

J. Electron. Packag. June 2023, 145(2): 021010.

Paper No: EP-22-1043

DOI: https://doi.org/10.1115/1.4056113

Published Online: November 11, 2022

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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering

Journal Articles

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Noriyuki Unno, Kazuhisa Yuki, Risako Kibushi, Atsuyuki Mitani

J. Electron. Packag. March 2023, 145(1): 011104.

Paper No: EP-22-1019

DOI: https://doi.org/10.1115/1.4055841

Published Online: October 22, 2022

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Topics: Boiling, Critical heat flux, Heat flux, Heat transfer, Nanofluids, Water, Thermal resistance, Aluminum, Wall temperature, Temperature

Journal Articles

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Satyam Saini, Pardeep Shahi, Pratik Bansode, Jimil M. Shah, Dereje Agonafer

J. Electron. Packag. June 2022, 144(2): 024501.

Paper No: EP-21-1070

DOI: https://doi.org/10.1115/1.4053363

Published Online: January 28, 2022

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Topics: Computational fluid dynamics, Data centers, Heat sinks, Particulate matter, Simulation, Contamination, Flow (Dynamics), Particle flow

Journal Articles

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Sanoop Thekkut, Maan Zaid Kokash, Rajesh Sharma Sivasubramony, Yuki Kawana, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. September 2022, 144(3): 031009.

Paper No: EP-21-1076

DOI: https://doi.org/10.1115/1.4051728

Published Online: September 15, 2021

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Topics: Creep, Deformation, Diffusion (Physics), Dislocations, Stress, Temperature, Annealing, Nanoparticles, Particulate matter, Copper

Journal Articles

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Satyam Saini, Jimil M. Shah, Pardeep Shahi, Pratik Bansode, Dereje Agonafer, Prabjit Singh, Roger Schmidt, Mike Kaler

J. Electron. Packag. September 2022, 144(3): 030801.

Paper No: EP-20-1054

DOI: https://doi.org/10.1115/1.4051255

Published Online: September 15, 2021

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Topics: Contamination, Corrosion, Data centers, Particulate matter, Reliability, Temperature, Copper, Silver, Failure

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan

J. Electron. Packag. December 2020, 142(4): 041005.

Paper No: EP-20-1011

DOI: https://doi.org/10.1115/1.4048729

Published Online: October 28, 2020

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Topics: Algorithms, Particulate matter, Optimization, Network models

Journal Articles

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Jimil M. Shah, Roshan Anand, Prabjit Singh, Satyam Saini, Rawhan Cyriac, Dereje Agonafer, Mike Kaler

J. Electron. Packag. December 2020, 142(4): 041103.

Paper No: EP-19-1096

DOI: https://doi.org/10.1115/1.4047469

Published Online: June 23, 2020

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Topics: Data centers, Dust, Leakage, Particulate matter, Sensors

Journal Articles

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

Ange-Christian Iradukunda, Josh Kasitz, Hayden Carlton, David Huitink, Amol Deshpande, Fang Luo

J. Electron. Packag. September 2020, 142(3): 031109.

Paper No: EP-20-1009

DOI: https://doi.org/10.1115/1.4046935

Published Online: May 4, 2020

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Topics: Electrical properties, Electronics, Iron, Nanocomposites, Nanoparticles, Phase change materials, Temperature, Thermal conductivity, Thermal properties, Heat

Journal Articles

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Yi Yang, Tao Long, Songlin Zhuang, Lai Wang, Yi Luo

J. Electron. Packag. September 2020, 142(3): 031101.

Paper No: EP-19-1109

DOI: https://doi.org/10.1115/1.4046763

Published Online: April 17, 2020

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Topics: Coating processes, Coatings, Composite materials, Crystals, Density, Particulate matter, Phosphors, Power density, Lasers, Aluminum

Journal Articles

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Jimil M. Shah, Abel Misrak, Dereje Agonafer, Mike Kaler

J. Electron. Packag. September 2019, 141(3): 031003.

Paper No: EP-18-1103

DOI: https://doi.org/10.1115/1.4043481

Published Online: May 8, 2019

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Topics: Data centers, Fourier transform infrared spectroscopy, Particulate matter, Scanning electron microscopy, Contamination, Dust

Journal Articles

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

J. Electron. Packag. September 2019, 141(3): 031005.

Paper No: EP-18-1076

DOI: https://doi.org/10.1115/1.4042982

Published Online: April 10, 2019

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Topics: Light-emitting diodes, Particulate matter, Phosphors, Silicones, Packaging, Wetting, Surface energy

Journal Articles

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Tingting Zhang, Bahgat G. Sammakia, Zhihao Yang, Howard Wang

J. Electron. Packag. September 2018, 140(3): 031006.

Paper No: EP-17-1110

DOI: https://doi.org/10.1115/1.4040204

Published Online: June 11, 2018

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Topics: Composite materials, Copper, Density, Nanocomposites, Packing (Shipments), Packings (Cushioning), Particulate matter, Thermal conductivity, Fillers (Materials), Silver

Journal Articles

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Pavan Kumar Vaitheeswaran, Ganesh Subbarayan

J. Electron. Packag. June 2018, 140(2): 020901.

Paper No: EP-17-1092

DOI: https://doi.org/10.1115/1.4039136

Published Online: May 9, 2018

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Topics: Elastic moduli, Network models, Particulate matter, Stiffness, Fillers (Materials), Particle size, Mechanical properties

Journal Articles

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Thong Kok Law, Fannon Lim, Yun Li, XuePeng Puan, G. K. E. Sng, J. W. Ronnie Teo

J. Electron. Packag. September 2017, 139(3): 031003.

Paper No: EP-16-1108

DOI: https://doi.org/10.1115/1.4036066

Published Online: June 14, 2017

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Topics: Bonding, Energy dissipation, Heat, Light-emitting diodes, Operating temperature, Packaging, Phosphors, Temperature, Thermal resistance, Light emission

Journal Articles

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler

J. Electron. Packag. June 2017, 139(2): 020903.

Paper No: EP-16-1143

DOI: https://doi.org/10.1115/1.4036363

Published Online: April 24, 2017

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Topics: Contamination, Corrosion, Data centers, Particulate matter, Temperature, Cooling, Reliability, Damage, Failure

Journal Articles

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Thomas Brunschwiler, Jonas Zürcher, Luca Del Carro, Gerd Schlottig, Brian Burg, Severin Zimmermann, Uwe Zschenderlein, Bernhard Wunderle, Florian Schindler-Saefkow, Rahel Stässle

J. Electron. Packag. December 2016, 138(4): 041009.

Paper No: EP-16-1090

DOI: https://doi.org/10.1115/1.4034927

Published Online: October 21, 2016

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Topics: Fillers (Materials), Particulate matter, Cavities, Nanoparticles

Journal Articles

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Joshua Gess, Sushil Bhavnani, R. Wayne Johnson

J. Electron. Packag. December 2016, 138(4): 041007.

Paper No: EP-16-1051

DOI: https://doi.org/10.1115/1.4034854

Published Online: October 20, 2016

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Topics: Coolants, Electronics, Flow (Dynamics), Fluids, Particulate matter, Design, Boiling, Fluid dynamics, Cooling

Journal Articles

Modular Microfluidic Filters Based on Transparent Membranes

E. Archibong, H. Tuazon, H. Wang, J. Winskas, A. L. Pyayt

J. Electron. Packag. December 2016, 138(4): 041002.

Paper No: EP-16-1049

DOI: https://doi.org/10.1115/1.4034369

Published Online: August 19, 2016

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Topics: Filters, Filtration, Membranes, Microfluidics, Particulate matter, Transparency, Manufacturing, Microparticles

Journal Articles

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Pradeep Lall, Hao Zhang

J. Electron. Packag. June 2015, 137(2): 021002.

Paper No: EP-14-1002

DOI: https://doi.org/10.1115/1.4028957

Published Online: June 1, 2015

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Topics: Filters, Light-emitting diodes, Particulate matter, Damage, Failure, Temperature, Physics

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Journal citation

NARROW

Effective Constitutive Relations for Sintered Nano Copper Joints

Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids

Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics

Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds

Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Development of a Precise and Cost-Effective Technique to Measure Deliquescent Relative Humidity of Particulate Contaminants and Determination of the Operating Relative Humidity of a Data Center Utilizing Airside Economization

Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications

High-Particle-Density YAG:Ce Phosphor Coating for High Power Laser Lighting

Identification and Characterization of Particulate Contaminants Found at a Data Center Using Airside Economization

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for Chip-on-Board Light-Emitting Diodes Packaging

Hybrid Nanocomposite Thermal Interface Materials: The Thermal Conductivity and the Packing Density

Estimation of Effective Thermal and Mechanical Properties of Particulate Thermal Interface Materials by a Random Network Model

Effect of Packaging Architecture on the Optical and Thermal Performances of High-Power Light Emitting Diodes

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Review on Percolating and Neck-Based Underfills for Three-Dimensional Chip Stacks

Single- and Two-Phase Particle Image Velocimetry Characterization of Fluid Flow Within a Liquid Immersion Cooled Electronics Module

Modular Microfluidic Filters Based on Transparent Membranes

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

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