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Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling

Weicheng Shu, Xinfeng Zhang, Xuan Yang, Xiaobing Luo
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031010.
Paper No: EP-21-1079
https://doi.org/10.1115/1.4051754
Published Online: September 15, 2021
View Article titled, A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling
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Topics: Cooling, Temperature, Temperature control, Water, Water temperature, Weight (Mass)
Includes: Supplementary data
Journal Articles

Array of Thermoelectric Coolers for On-Chip Thermal Management

Owen Sullivan, Man Prakash Gupta, Saibal Mukhopadhyay, Satish Kumar
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021005.
https://doi.org/10.1115/1.4006141
Published Online: June 11, 2012
View Article titled, Array of Thermoelectric Coolers for On-Chip Thermal Management
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Topics: Temperature, Thermoelectric coolers, Steady state, Cooling, Transients (Dynamics), Shapes, Temperature control
Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021007.
https://doi.org/10.1115/1.4005905
Published Online: June 11, 2012
View Article titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks
Journal Articles

From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy

Ed J. Walsh, Thomas J. Breen, Jeff Punch, Amip J. Shah, Cullen E. Bash
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031008.
https://doi.org/10.1115/1.4004657
Published Online: September 21, 2011
View Article titled, From Chip to Cooling Tower Data Center Modeling: Influence of Chip Temperature Control Philosophy
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Topics: Cooling, Cooling towers, Data centers, Heat sinks, Temperature, Temperature control, Modeling, Thermal resistance, Flow (Dynamics)
Journal Articles

A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing

Matthew Sweetland, John H. Lienhard, V, Alexander H. Slocum
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031012.
https://doi.org/10.1115/1.2966437
Published Online: August 12, 2008
View Article titled, A Convection/Radiation Temperature Control System for High Power Density Electronic Device Testing
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Topics: Convection, Cooling, Lasers, Nozzles, Radiation (Physics), Temperature, Temperature control, Testing, Manifolds, Pressure
Journal Articles

Review of Heat Transfer Technologies in Electronic Equipment

L. T. Yeh
Journal: Journal of Electronic Packaging
Article Type: Technical Papers
J. Electron. Packag. December 1995, 117(4): 333–339.
https://doi.org/10.1115/1.2792113
Published Online: December 1, 1995
View Article titled, Review of Heat Transfer Technologies in Electronic Equipment
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Topics: Electronic equipment, Heat transfer, Air Force, Design, Electronic systems, Electronics, Energy dissipation, Failure, Heat, Reliability