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Keywords: CFD
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2020, 142(1): 011008.
Paper No: EP-19-1056
Published Online: October 10, 2019
...Wen-Xiao Chu; Jui-Lin Wu; Yeng-Yung Tsui; Chi-Chuan Wang This study focused on the improved designs of airflow management in container data centers having overhead air supply. The computational fluid dynamics (CFD) model is first validated with experimental results. Then, the impact of grille...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2019, 141(3): 031008.
Paper No: EP-18-1108
Published Online: May 17, 2019
... optimal strategy is adopted for which the computational fluid dynamics (CFD) results, artificial neural network (ANN), and MOGA are combined. The tubes elliptic ratio and Reynolds number are the design variables. The objective functions include Colburn factor (j) and friction factor (f). The CFD results...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021001.
Paper No: EP-18-1068
Published Online: February 25, 2019
...Georgios Karamanis; Marc Hodes We provide an algorithm to optimize the geometry of the fins in an array of longitudinal-fin heat sinks (HSs) in, e.g., a blade server, which is a prohibitively long task using computational fluid dynamics (CFD). First, banks of CFD simulations are run to precompute...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021010.
Paper No: EP-14-1016
Published Online: June 1, 2015
... December 5, 2014; published online January 21, 2015. Assoc. Editor: Madhusudan Iyengar. 11 02 2014 05 12 2014 21 01 2015 This paper presents the results of an experimentally validated computational fluid dynamics (CFD) model for a data center with fully implemented fan curves...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011004.
Paper No: EP-13-1140
Published Online: October 6, 2014
...Mohamed L. Elsayed; Osama Mesalhy Subscripts b = base plate D h = hydraulic diameter Abbreviations CFD = computational fluid dynamics RNG = Reynolds normalized group 3D = three-dimensional 1 Corresponding author. Contributed by the Electronic...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011006.
Published Online: March 19, 2012
.... With the measured data of temperatures and airflow velocities, the mathematic model is constructed using a commercial Computational Fluid Dynamics (CFD) software and experimental data to present a comparison between test results and numerical simulations. The area of the data center is 311 square meters...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021009.
Published Online: June 25, 2010
.... The computational fluid dynamics (CFD) software that is available has improved over the years. CFD software specific to data center thermal analysis has also been developed. This has improved the time lines of providing some quick analysis of the effects of new hardware into the data center. But it is critically...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021007.
Published Online: April 2, 2009
... dynamics (CFD) software, during the design stage. PCBs are chiefly composed of copper ( 398 W / m K ) patterns and epoxy ( 0.3 W / m K ) insulator. The thermal conductivity of copper is more than 1000 times that of epoxy, so heat diffusion via the copper...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011006.
Published Online: January 31, 2008
..., such as the manufacturing cost and the design freedom. More importantly, this study has provided a further step in the direction of demonstrating the opening effect. 19 01 2007 07 06 2007 31 01 2008 computational fluid dynamics cooling natural convection substrates CFD experimental opening...
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 28–34.
Published Online: May 1, 2006
... fluid dynamics (CFD) and finite element analyses (FEA). CFD analysis was used to extract transient heat transfer coefficients while subsequent FEA–thermal and FEA–structural analyses were used to calculate temperature distribution and strain energy density, respectively. Hong , B. Z...