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Keywords: JEDEC
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
Published Online: March 19, 2012
.... , 2004 , “ Impact Life Prediction Modeling of TFBGA Packages Under Board Level Drop Test ,” J. Microelectron. Reliab. , 44 , pp. 1131 – 1142 . 10.1016/j.microrel.2004.03.005 12 Yeh , C. L. , and Lai , Y. S. , 2006 , “ Support Excitation Scheme for Transient Analysis of JEDEC Board...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. March 2007, 129(1): 105–108.
Published Online: June 6, 2006
... to JEDEC drop test condition B , which features a half-sine impact acceleration pulse with a peak acceleration of 1500 g and a pulse duration of 0.5 ms . The transient finite element analysis follows the support excitation scheme and incorporates an implicit time integration...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 281–284.
Published Online: October 7, 2005
...Tong Hong Wang; Chang-Chi Lee; Yi-Shao Lai; Yu-Cheng Lin In this work, thermal characteristics of a board-level chip-scale package, subjected to coupled power and thermal cycling test conditions defined by JEDEC, are investigated through the transient thermal analysis. Tabular boundary conditions...