1-3 of 3
Keywords: ceramics
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Analysis and Prediction of Vibration-Induced Solder Joint Failure for a Ceramic Column Grid Array Package

Andy Perkins, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011012.
https://doi.org/10.1115/1.2837520
Published Online: February 14, 2008
... components under vibration conditions. In particular, this paper discusses the out-of-plane sinusoidal vibration experiments at 1 G , numerical modeling, and fatigue life prediction for a 42.5 × 42.5 × 4 mm 3 1089 input∕output ceramic column grid array (CCGA) package on a 133 × 56 × 2.8 mm 3 FR4 board...
View Article titled, Analysis and Prediction of Vibration-Induced Solder Joint Failure for a <span class="search-highlight">Ceramic</span> Column Grid Array Package
Open the PDF for Analysis and Prediction of Vibration-Induced Solder Joint Failure for a <span class="search-highlight">Ceramic</span> Column Grid Array Package in another window
Topics: Ceramics, Failure, Fatigue life, Solder joints, Solders, Vibration, Stress, Cycles, Vehicles, Finite element model
Journal Articles

High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure

Hong He, Renli Fu, Yanchun Han, Yuan Shen, Deliu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 469–472.
https://doi.org/10.1115/1.2804097
Published Online: April 4, 2007
...Hong He; Renli Fu; Yanchun Han; Yuan Shen; Deliu Wang Traditionally, large quantities of ceramic fillers are added to polymers in order to obtain high thermally conductive polymer composites, which are used for electronic encapsulants. However, that is not cost effective enough. In this study, Si 3...
View Article titled, High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure
Open the PDF for High Thermal Conductive Si 3 N 4 Particle Filled Epoxy Composites With a Novel Structure in another window
Topics: Ceramics, Composite materials, Epoxy resins, Fillers (Materials), Particulate matter, Polymers, Thermal conductivity, Dielectric losses, Polymer composites
Journal Articles

Engineering of Superconductive Ceramics

Anatoly E. Rokhvarger, Lubov A. Chigirinsky
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 26–33.
https://doi.org/10.1115/1.1646423
Published Online: April 30, 2004
...Anatoly E. Rokhvarger; Lubov A. Chigirinsky Recently awarded U.S. patents and proven in the lab, our versatile high temperature superconductor (HTS) ceramic nanotechnology utilizes a novel material formulation of nanosize HTS ceramic powder and of multi-purpose silicone polymer additive...
View Article titled, Engineering of Superconductive <span class="search-highlight">Ceramics</span>
Open the PDF for Engineering of Superconductive <span class="search-highlight">Ceramics</span> in another window
Topics: Ceramics, Nanotechnology, Silver, Wire, Adhesion, Durability, Crystals, Copper, Temperature