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Keywords: chemical reactionClose
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
... identification on the suggested chemical reaction formula. This finding can enhance understanding of the mechanism that drives no-flow underfill voiding and can develop a void-free flip chip assembly process using no-flow underfill material for cost effective and high performance electronics packaging...