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Keywords: compressive strength
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Journal Articles
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. December 2011, 133(4): 045501.
Published Online: October 25, 2011
... used, the yield surfaces for each can be different. This is analogous to the well-known and classical Mohr-Coulomb model (for geologic materials) where the strength envelope is valid for compression and not for tension because the tensile strength is different from the compressive strength. Similarly...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041003.
Published Online: November 23, 2010
...–3.0Ag–0.5Cu lead-free solder for several loading conditions. The method can separate between the time-independent plastic strain and the time-dependent creep strain in cyclic inelastic deformation of solder alloys. 09 12 2009 14 09 2010 23 11 2010 23 11 2010 compressive...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 235–236.
Published Online: August 24, 2004
... the stress exceeds ∼ 7 MPa . The relative dielectric constant is higher during loading than subsequent unloading. 24 08 2004 24 08 2004 alumina permittivity electronics packaging compressive strength stress analysis thermal stresses Alumina (aluminum oxide, Al 2 O 3...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
Published Online: January 11, 2000
... polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal expansion compressive strength elastic moduli thermoelasticity The residual thermal stresses in molding compounds affect the mechanical reliability of microelectronic...