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Journal Articles

A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging

Xingjun Yao, Weijie Jiang, Jiahui Yang, Junjie Fang, Wenjun Zhang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041003.
Paper No: EP-20-1094
DOI: https://doi.org/10.1115/1.4052275
Published Online: November 22, 2021
... conservation of energy Natural Science Foundation of Shanghai 10.13039/100007219 15ZR1409300 The flip-chip underfill packaging technology was developed several decades ago [ 1 ], and it is widely used in electronics industry. The basic idea with this technology is to fill a material...
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Topics: Computational fluid dynamics, Flip-chip, Flip-chip packages, Flow (Dynamics), Simulation, Solders, Surface energy, Uncertainty, Shapes, Packaging