... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received February 2002. Associate Editor: A. Y-H. Hung. 01 February 2002 30 04 2004 thermal energy storage finite volume methods product design correlation methods...

... displacement measurement atomic force microscopy integrated circuit reliability nondestructive testing correlation methods flip-chip devices image processing crack detection Quality and suitability of thermo-mechanical design and optimization of advanced electronic packages by means of finite...