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Keywords: differential scanning calorimetry
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...; this was found to be the main source of the extensively formed underfill voiding. This mechanism of chemically and thermally induced voids was explained using void formation study, differential scanning calorimetry thermogram comparison, and gas chromatography and mass spectroscopy chemical composition...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 12–17.
Published Online: March 21, 2005
... paste, the differential scanning calorimetry analysis was carried out. Joint morphology, the formation of conduction path, and the self-organized characteristics were examined. Melting fillers were preserved their initial spherelike form for nonreductive adhesive, although enlargement of the alloy...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 232–236.
Published Online: July 8, 2004
... method with the DSC model for chip-substrate problem. solders finite element analysis calibration materials testing electronics packaging differential scanning calorimetry 01 May 2003 01 January 2004 08 07 2004 Contributed by the Electronic and Photonic Packaging...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 87–93.
Published Online: April 30, 2004
... received Oct. 2003. Associate Editor: B. Michel. 01 Oct 2003 30 04 2004 gold lead bonding wires (electric) indentation crystal microstructure recrystallisation differential scanning calorimetry hardness elastic moduli yield strength yield stress secondary ion mass spectra...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
Published Online: December 12, 2002
... by use of other means, such as differential scanning calorimetry (DSC). In this study, a newly designed two-plunger-type dilatometer suitable for measuring volume change of EMC materials was presented. The experimental procedure consisted of two parts: kinetic model of EMC by DSC...
Journal Articles
Article Type: Additional Technical Papers
J. Electron. Packag. December 2002, 124(4): 391–396.
Published Online: December 12, 2002
... 20, 2002. Associate Editor: A. Tay. 01 April 2001 20 April 2002 12 12 2002 encapsulation flip-chip devices chip-on-board packaging integrated circuit packaging plastic packaging polymer films heat treatment differential scanning calorimetry The reliability...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 268–272.
Published Online: December 22, 1999
... is identified by the differential scanning calorimetry (DSC). Values of coefficient of thermal expansion (CTE) before and after glass transition temperature T g and shear modulus ( G ′ and G ″ ) are measured by thermomechanical analysis (TMA) and dynamic mechanical...