... with the displacement measurements. A FEA model of the final design, not the mockup, of the physics package was created and was used to predict that the physics package will survive a 1800 g shock of any duration in any direction without exceeding the Cirlex yield stress of 49 MPa. In addition, the package will survive...

...) and the measurement of Poisson ratios from a uniaxial stress testing. Reasonable maximum material load is assumed. Obviously the measurement resolution of the correlation technique is insufficient to determine material properties by a single point-by-point displacement measurement within one micrograph...

... properly, could damage even traditional silicon oxide. thermal management (packaging) lead bonding integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain...

...H.-Y. Yeh; K. Cote In-situ measurements were performed on organic based substrates under mechanical loading as well as land grid array electronic packages under thermal cycling. Whole field displacement measurements obtained from this analysis were compared with results obtained from similar finite...

... ball grid arrays displacement measurement calibration finite element analysis light interferometry stress measurement Plastic Ball Grid Array (PBGA) packages are cost-effective surface mounting packages with a high density interconnection, low profiles, and lightweight. They are currently...