...Y. Zhou; M. Al-Bassyiouni; A. Dasgupta In this paper, the vibration durability of both SAC305 and Sn37Pb interconnects are investigated with narrow-band harmonic vibration tests conducted at the first natural frequency of the test, printed wiring board, using constant-amplitude excitation. A time...

... described above is then used for parametric study of the durability of voided solder balls in a ChipArray Thin Core BGA with 132 I/O (CTBGA132) assemblies, under thermal cycling. The critical solder ball in the package is selected and is error seeded with voids with different sizes and various distances...

...Leila Jannesari Ladani; Abhijit Dasgupta The effect of process-induced voids on the durability of Sn–Pb and Pb-free solder interconnects in electronic products is not clearly understood. Experimental studies have provided conflicting ambiguous conclusions, showing that voids may sometimes...

...T. Zhang; S. Rahman; K. K. Choi; K. Cho; P. Baker; M. Shakil; D. Heitkamp This paper presents a global–local methodology for predicting mechanical deformation and fatigue durability of solder joints in electronic packaging systems subject to cyclic thermal loading. It involves a global deformation...

...Qian Zhang; Abhijit Dasgupta; Peter Haswell This study is motivated by the urgent need in the electronics industry for mechanical properties and durability of Pb-free solders because the use of Pb will be banned in the EU by July 1, 2006. The isothermal mechanical durability of three NEMI...

... using the Pb-free solders. There are extensive databases of mechanical properties, durability properties (for both mechanical and thermal cycling), and micromechanical characteristics for Sn-Pb solders. But similar databases are not readily yet available for Pb-free solders to predict its mechanical...

... materials have the required mechanical properties and durability and can be conveyor manufactured in any size and shape, including continuous flexible multi-strand round wire and electronics. Rosner , C. H. , 1998 , “ Emerging 21st Century Markets and Outlook for Applied Superconducting Products...