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Keywords: electronic speckle pattern interferometry
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Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... properly, could damage even traditional silicon oxide. thermal management (packaging) lead bonding integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2002, 124(3): 277–280.
Published Online: July 26, 2002
... by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received at ASME Headquarters September 19, 2001. Associate Editor: D. T. Read. 19 September 2001 26 07 2002 electronic speckle pattern interferometry thermal management...