... thermal management electronics packaging phase change materials codesign thermal system Codesign has the potential to significantly advance the state-of-the-art electronic packaging by moving away from a sequential design approach and replacing it with an inclusive design approach for which...

...] Knoerr , M. , Kraft , S. , and Schletz , A. , 2010 , “ Reliability Assessment of Sintered Nano-Silver Die Attachment for Power Semiconductors ,” Electronic Packaging and Technology Conference (EPTC) , Singapore, Dec. 8–10, pp. 56 – 61 . [16] Mysore , K. , Subbarayan , G...

... adhesive bonding copper electronics packaging elemental semiconductors gold plates (structures) shear strength silicon solders thermal stresses thin films tin bimaterial assembly interfacial shearing stress peeling stress shear compliance bond layer Thermomechanical stresses...

...Etienne L. Bonnaud Reliable drop test simulations of electronic packages require reliable material characterization of solder joints. Mechanical properties of lead-free solder were here experimentally investigated for both monotonic and cyclic loading at different strain rates. With regards...

... is obtained with a 3 dB bandwidth of about 15 GHz. 11 10 2010 31 08 2011 09 12 2011 09 12 2011 computational electromagnetics electronics packaging microstrip lines modules optical interconnections optical modulation optoelectronic devices semiconductor lasers...

..., but time- and temperature-dependence. For simplification of the stress constitutive models, particularly for applications on electronic packaging can be found in literature, the time-dependent behavior could be neglected. Otherwise, the property only considered as a function of temperature can achieve time...

... 2010 07 07 2011 08 12 2011 08 12 2011 electronics packaging thermal stresses transient analysis weapons Due to the highly dynamic nature of gun launch, many electronic systems resort to potted designs in order to achieve some degree of reliability [( 1 2 3 )]. It has...

...Yongchang Lee; Cemal Basaran Demand for long-term reliability of electronic packaging has lead to a large number of studies on viscoplastic behavior of solder alloys. Various creep models for solder alloys have been proposed. They range from purely empirical to mechanism based models where...

... 09 2011 30 09 2011 cooling electronics packaging integrated circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1...

... the crack driving force in it and consequently alleviates the risk of the intermetallic compound layer fracturing. 05 02 2011 22 06 2011 14 09 2011 14 09 2011 electronics packaging failure analysis finite element analysis solders solder joint intermetallic compounds...

...M. O. Özdemir; H. Yüncü The objective of this study is to predict numerically the optimal spacing between parallel heat generating boards. The isothermal boards are stacked in a fixed volume of electronic package enclosed by insulated lateral walls, and they are cooled by laminar forced convection...

... density electromigration electronics packaging failure analysis numerical analysis reliability sensitivity analysis solders electromigration sensitivity analysis time-to-failure It is well known that, as the electronics industry continues to push for high performance...

...Tarek Ragab, Dr.; Cemal Basaran, Dr. 03 04 2011 01 06 2011 01 06 2011 01 07 2011 01 07 2011 carbon nanotubes chirality electron field emission electronics packaging mechanical strength molecular dynamics method nanoelectronics semiconductor nanotubes...

...) are able to correspond to profiles found in XRD database, showing that 304SS has face-centered cubic crystal lattice. The Ni strike technique is used as surface treatment to make 304SS bondable to other metals, such as silver (Ag), copper (Cu), and gold (Au), commonly used in electronic packaging. Cross...

...Drazen Fabris; Michael Rosshirt; Christopher Cardenas; Patrick Wilhite; Toshishige Yamada; Cary Y. Yang Improvements in thermal interface materials (TIMs) can enhance heat transfer in electronics packages and reduce high temperatures. TIMs are generally composed of highly conductive particle...

... was created for an opto-electronic package, and validated by experiments. The presented method gives a very good case study for such exercises. In the paper of Martinez-Galvan et al., “Film Thickness and Heat Transfer Measurements in a Spray Cooling System With R134a,” experimental measurements...

... output only about 3% lower than that of the FTWL package. electronics packaging light emitting diodes phosphors silicon compounds light emitting diode correlated color temperature color-rendering index total internal reflection lumens Optical power as a function of phosphor weight...

.... A comparison study between the results from the CFD simulation and the ANN analysis indicates that the ANN accurately predicts the cooling performance of electronic components within the given range of data. computational fluid dynamics cooling copper electronics packaging laminar flow nanofluidics...

... is briefly exposed and the method is applied to some two-layer virtual structures. The obtained results are compared with those obtained using standard FEM analyses. electronics packaging finite element analysis power electronics thermal analysis Thanks to all these facilities the DJOSER...

...Arun Prakash Raghupathy; John Janssen; Attila Aranyosi; Urmila Ghia; Karman Ghia; William Maltz In the current study, a network-based resistor model has been developed for thermal analysis of a complex opto-electronic package called small form-factor pluggable device (SFP). This is done using...