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Keywords: finite element simulation
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2013, 135(4): 041009.
Paper No: EP-13-1070
Published Online: November 18, 2013
... and parameters were discussed. thermosonic wire bonding wire looping process material properties capillary parameters capillary trace finite element simulation Wire-bonding is a traditional interconnect method can be widely used in modern three-dimensional (3D) packages due to its existing...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031003.
Published Online: June 23, 2009
... observed and discussed. In addition, the final comparisons between the experimental data and the finite element simulations show good consistency. Tummala , R. R. , Rymaszewski , E. J. , and Klopfenstein , A. G. , 1997 , Microelectronics Packaging Handbook , 2nd ed. , Chapman...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 94–99.
Published Online: April 30, 2004
... analysis J -integral Flip-chip Interfacial delamination Crack propagation Finite element simulation Flip chip on broad (FCOB) is being increasingly used for a wide range of applications such as computers, portable electronics and automotive application. The FCOB provides shorter...