Skip Nav Destination
1-1 of 1
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
Published Online: March 19, 2012
...Hung-Jen Chang; Chau-Jie Zhan; Tao-Chih Chang; Jung-Hua Chou In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0 Ag 0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0 Ag...