... 09 2011 30 09 2011 cooling electronics packaging integrated circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1...

... integrated circuits integrated circuit interconnections integrated optoelectronics optical interconnections printed circuits system-in-package thermal management (packaging) three-dimensional integrated circuits optoelectronics embedded 3D hybrid integration system in package thermal design...

... microstructure fracture integrated circuit interconnections numerical analysis printed circuits solders halogen free lead free solder alloy intermetallic characteristics joint strength The environmentally friendly green product is an irreversible trend for electronic industries, following...

... inspection by a synchrotron radiation X-ray microtomography system. 11 08 2010 26 03 2011 23 06 2011 23 06 2011 automatic optical inspection computerised tomography crack detection flip-chip devices integrated circuit interconnections integrated circuit reliability...

... geometry are proposed. 02 10 2008 14 06 2009 12 11 2009 12 11 2009 integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging...

... bumping chip stacking chip on board manufacturing technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009...

... of inelastic strain and damage in solder joints, which is contrary to the popular belief that most vibration-induced strains are usually elastic. durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations 29 10 2007 05 12 2008 25 02 2009...

.... 0361-5235 10.1007/s11664-004-0169-8 , 33 ( 11 ), pp. 1389 – 1400 . 08 08 2007 09 08 2008 13 02 2009 ball grid arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging...

... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...

... ball grid arrays ceramic packaging computational fluid dynamics deformation finite element analysis flip-chip devices integrated circuit interconnections integrated circuit packaging integrated circuit reliability light interferometry plastic packaging thermal expansion thermomechanical...

..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...

... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...

..., the interconnect behavior is a key issue in the long-term performance of the whole system. interconnect interface interferometer micropolar theory ball grid arrays integrated circuit interconnections stress-strain relations thermal analysis 16 02 2007 07 09 2007 15 05 2008...

... 2008 assembling flip-chip devices integrated circuit interconnections integrated circuit layout integrated circuit reliability thermal stress cracking viscoelasticity In Part 1 of this paper, various failure mechanisms associated with the short-time wave propagation in the flip...

... solder joint containing microelectronic packages. Material parameters relevant to the model are estimated via a coupled experimental and numerical technique. copper alloys creep fatigue cracks fatigue testing fracture mechanics integrated circuit interconnections integrated circuit modelling...

... ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections The increased proliferation of embedded and mobile devices has led to a sharp rise in the demand for nonvolatile memory (NVM...

... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...

... packaging integrated circuit interconnections integrated circuit reliability printed circuits In prior generations of automotive electronics based on surface mount technology and laminated substrates, packaging of microprocessor and application-specific integrated circuit (ASIC) chips...

... and failure mechanisms has become a consequential topic in the electronic packaging industry that desires a reliable packaging design. electromigration solder bump flip-chip reliability electrothermal coupling analysis flip-chip devices electromigration solders integrated circuit...

... bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity 03 August 2003 13 June 2004 03 06 2005 Contributed by the Electronic and Photonic...