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Keywords: integrated circuit interconnections
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031013.
Published Online: September 30, 2011
... circuit interconnections printed circuits compact thermal, model Delphi, vias micro-vias genetic algorithms In 1996, the component-level thermal design was revolutionized by compact thermal model [( 1 )] capabilities, which were promoted by an European project, named DELPHI...
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2009, 131(4): 044502.
Published Online: November 12, 2009
... geometry are proposed. 02 10 2008 14 06 2009 12 11 2009 12 11 2009 integrated circuit interconnections integrated circuit packaging solders Empirical life models have been used for decades to predict the fatigue life of solder joints. The microelectronics packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041007.
Published Online: October 29, 2009
... technology finite elements stress analysis micromechanics elastic moduli finite element analysis gold integrated circuit bonding integrated circuit interconnections stress effects ultrasonic bonding 12 07 2008 16 09 2009 29 10 2009 2009 American Society of Mechanical...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011016.
Published Online: February 25, 2009
... estimates of the actual fatigue curves. 29 10 2007 05 12 2008 25 02 2009 durability fatigue integrated circuit interconnections lead alloys solders tin alloys vibrations Vibration loading is commonly encountered during the service life of electronic products...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011008.
Published Online: February 13, 2009
... arrays copper alloys cracks creep testing fatigue testing finite element analysis integrated circuit interconnections integrated circuit packaging integrated circuit reliability life testing silver alloys solders stress-strain relations tin alloys As technology progresses, both...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011007.
Published Online: February 12, 2009
... sensors impact testing integrated circuit interconnections integrated circuit layout integrated circuit measurement integrated circuit modelling integrated circuit reliability integrated circuit testing mobile handsets soldering drop impact reliability drop impact modeling chip scale...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2008, 130(4): 044501.
Published Online: November 17, 2008
..., the measured insertion loss is less than 3 dB for frequencies of up to 35 GHz and the return loss is higher than 15 dB for frequencies of up to 29 GHz using CPS flip-chip configuration. 11 12 2007 09 04 2008 17 11 2008 coplanar waveguides flip-chip devices integrated circuit...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
Published Online: July 29, 2008
... for full chip Joule heating simulations and for clock signal propagation simulations, which are performed as part of designing next generation chip architectures. 13 03 2006 23 10 2007 29 07 2008 heat conduction integrated circuit interconnections mesh generation...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021010.
Published Online: May 15, 2008
..., the interconnect behavior is a key issue in the long-term performance of the whole system. interconnect interface interferometer micropolar theory ball grid arrays integrated circuit interconnections stress-strain relations thermal analysis 16 02 2007 07 09 2007 15 05 2008...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021009.
Published Online: May 9, 2008
.... The approach along with the numerical procedures developed for the investigation can be a practical tool for realizing better device reliability and thus high manufacturing yield. 21 02 2007 26 09 2007 09 05 2008 assembling flip-chip devices integrated circuit interconnections...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021003.
Published Online: April 15, 2008
... circuit interconnections integrated circuit modelling integrated circuit packaging integrated circuit reliability life testing silver alloys solders tin alloys lead-free solder acceleration factors cohesive zone modeling Solder joint fatigue has been the subject of a great deal...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011011.
Published Online: February 12, 2008
... common for many flash memory applications ( 1 ). ball grid arrays chip scale packaging compression moulding deformation encapsulation integrated circuit bonding integrated circuit interconnections 10 07 2007 15 08 2007 12 02 2008 e-mail: amip.shah...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 460–468.
Published Online: April 9, 2007
... 09 04 2007 finite element analysis integrated circuit interconnections integrated circuit reliability integrated circuit testing low-k dielectric thin films Power and latency are fast becoming major bottlenecks in the design of high performance microprocessors and computers...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 382–390.
Published Online: March 7, 2007
... packaging integrated circuit interconnections integrated circuit reliability printed circuits In prior generations of automotive electronics based on surface mount technology and laminated substrates, packaging of microprocessor and application-specific integrated circuit (ASIC) chips...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 56–62.
Published Online: May 19, 2006
... integrated circuit interconnections life testing fatigue testing reliability temperature distribution tin alloys copper alloys silver alloys current density electromigration solder bump flip-chip reliability electrothermal coupling analysis Electromigration is responsible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 113–119.
Published Online: June 3, 2005
... bonding integrated circuit interconnections integrated circuit metallisation integrated circuit reliability contact resistance surface morphology ageing corrosion testing swelling humidity 03 August 2003 13 June 2004 03 06 2005 Contributed by the Electronic and Photonic...