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Keywords: intermetallic compound
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041001.
Paper No: EP-21-1043
Published Online: October 6, 2021
... to 218.5 °C and temperature range of solid–liquid coexistence phase reduces at the same time. The Sn-Cu 0.7 matrix consisted of small particles of Cu 6 Sn 5 within β-Sn equiaxial grains and did not significantly influence solder hardness. Moreover, much intermetallic compound of plate-like Ag 3 Sn and rod...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021102.
Paper No: EP-21-1053
Published Online: September 13, 2021
...@toshiba.co.jp e-mail:  akihiro.goryu@toshiba.co.jp e-mail:  tomoya1.fumikura@toshiba.co.jp e-mail:  kenji.hirohata@toshiba.co.jp 31 03 2021 05 08 2021 13 09 2021 electromigration power module solder joint intermetallic compound coupled analysis current crowding...