... to 218.5 °C and temperature range of solid–liquid coexistence phase reduces at the same time. The Sn-Cu 0.7 matrix consisted of small particles of Cu 6 Sn 5 within β-Sn equiaxial grains and did not significantly influence solder hardness. Moreover, much intermetallic compound of plate-like Ag 3 Sn and rod...

... electromigration power module solder joint intermetallic compound coupled analysis current crowding Power modules are packages that contain many semiconductor devices, such as metal-oxide-semiconductor field-effect transistors, insulated gate bipolar transistors, and PiN diodes, and are a fundamental...