... repetitive exposure to mechanical shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper alloys is Sn3Ag0.5Cu. The high strain rate properties of lead-free solder alloys are scarce. Typical material...

...Hung-Jen Chang; Chau-Jie Zhan; Tao-Chih Chang; Jung-Hua Chou In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0 Ag 0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0 Ag...

...M. Meilunas; P. Borgesen The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the requirement to change, with a choice between imperfect alternatives. One...

... for 6.35 × 6.35 × 0.6 mm 3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps. Oresjo , S. , 2002 , “ New Study Reveals Component Defect Levels ,” Circuits Assembly , May, pp. 39 – 43 . Semmens , J. E. , 2000 , “ Flip Chips and Acoustic Micro Imaging...

...Mohd F. Abdulhamid; Cemal Basaran Thermomigration experiments were conducted to study the change in mechanical properties of 95.5Sn–4Ag–0.5Cu (SAC405) lead-free solder joint under high temperature gradients. This paper presents some observations on samples that were subjected to 1000 ° C / cm...

... cooling and heating ramps, respectively. Global FEA model for CTBAG132 and the critical ball at the outer corner 03 02 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) FEA voids lead-free thermomechanical...