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Keywords: lead-free
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Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2015, 137(1): 011010.
Paper No: EP-14-1001
Published Online: March 1, 2015
... repetitive exposure to mechanical shock. Industry migration to lead-free solders has resulted in proliferation of a wide variety of solder alloy compositions. One of the popular tin-silver-copper alloys is Sn3Ag0.5Cu. The high strain rate properties of lead-free solder alloys are scarce. Typical material...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2012, 134(1): 011011.
Published Online: March 19, 2012
...Hung-Jen Chang; Chau-Jie Zhan; Tao-Chih Chang; Jung-Hua Chou In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn 4.0 Ag 0.5 Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn 1.0 Ag...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021001.
Published Online: June 22, 2011
...M. Meilunas; P. Borgesen The mandated switch of the overwhelming part of microelectronics assembly to lead-free soldering has left the manufacturers of many high reliability products, which are still exempt from the requirement to change, with a choice between imperfect alternatives. One...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011013.
Published Online: February 18, 2009
... for 6.35 × 6.35 × 0.6 mm 3 flip chips and flip chips (“SiMAF;” Siemens AG) with lead-free solder bumps. Oresjo , S. , 2002 , “ New Study Reveals Component Defect Levels ,” Circuits Assembly , May, pp. 39 – 43 . Semmens , J. E. , 2000 , “ Flip Chips and Acoustic Micro Imaging...
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 273–277.
Published Online: September 8, 2006
... cooling and heating ramps, respectively. Global FEA model for CTBAG132 and the critical ball at the outer corner 03 02 2006 08 09 2006 ball grid arrays durability finite element analysis reliability solders voids (solid) FEA voids lead-free thermomechanical...