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Keywords: moulding
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Journal Articles
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031013.
Published Online: July 31, 2009
... and surface mount device compatible features, making it suitable for portable commercial devices. 22 09 2008 27 03 2009 31 07 2009 electronics packaging elemental semiconductors finite element analysis membranes moulding photoresists piezoresistive devices pressure sensors...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2007, 129(1): 19–27.
Published Online: September 20, 2006
..., upper surface of the lead frame, of the molding model 24 02 2004 20 09 2006 integrated circuit packaging integrated circuit modelling moulding temperature distribution finite element analysis IC packaging molding process thermal stress finite element method...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 460–465.
Published Online: January 21, 2005
... packaging reliability moisture humidity vapour pressure moulding Moisture plays an important role in the reliability of plastic electronic packaging. The presence of moisture in the plastic package induces hygroscopic stress through hygroswelling, induces vapor pressure that is responsible...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2005, 127(3): 324–334.
Published Online: December 2, 2004
... encapsulation moulding mass production 19 04 2004 02 12 2004 The presented paddle shift modeling solution is composed of four steps (Fig. 3 ): preprocessing, 3D mold-filling analysis, paddle-loading analysis , and structural analysis . In the preprocessing step, the solid meshes...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 34–36.
Published Online: April 30, 2004
...David J. J. Lowrie Two high profile goals of the electronics industry today are lead free and embedded passives. The following describes the design and construction of a populated and planarized “PCB” which accomplishes these goals. The Moulded Electronic Package also integrates bare die and other...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 539–548.
Published Online: December 15, 2003
... based on the reliable prediction of the packaging process stresses. Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received Nov. 2002. 01 Nov 2002 15 12 2003 packaging moulding encapsulation...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 520–526.
Published Online: December 15, 2003
... moulding polymers internal stresses thermal stresses finite element analysis creep viscoelasticity At present, thermo-mechanical reliability of integrated circuit (IC) packages is still one of the major concerns in the electronic industry. Critical stress levels may be induced in the package...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 139–143.
Published Online: March 14, 2003
... collisions and improper ram speed. If the deformation of wire is too large, it can cause a short circuit (due to touching of adjacent wires) or open circuit (due to wire breakage). integrated circuit packaging encapsulation drag moulding wires (electric) electronic engineering computing...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 334–339.
Published Online: December 12, 2002
... received at ASME Headquarters, May 2002. Guest Editor: Bernd Michel. 04 December 2000 01 May 2002 12 12 2002 chip scale packaging failure analysis reliability substrates organic compounds moisture delamination moulding BT Substrate PCT (Pressure Cooked Test) Mold...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 371–373.
Published Online: December 12, 2002
... December 2000 01 May 2002 12 12 2002 polymers moulding equations of state extensometers differential scanning calorimetry shrinkage thermal expansion Epoxy molding compound (EMC) is commonly used in the plastic IC encapsulation. This compound is composed of an epoxy resin...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2002, 124(2): 111–114.
Published Online: May 2, 2002
... techniques moulding optical fabrication optical disc storage birefringence temperature distribution optical polymers 20 April 2001 02 05 2002 Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received...
Journal Articles
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 366–371.
Published Online: February 6, 2001
... integrated circuit packaging plastic packaging electronic design automation encapsulation moulding Integrated circuits are used in virtually every electronic product available on the market today. These microcircuits are encapsulated or packaged in one of several different materials including...
Journal Articles
Publisher: ASME
Article Type: Papers On Reliability
J. Electron. Packag. March 2001, 123(1): 88–94.
Published Online: August 8, 2000
... are needed for further improvement. Solder crack resistance of FPBGA and warpage of MAP-BGA have been studied. Two conclusions are summarized below. ball grid arrays reliability moulding fine-pitch technology Plastic Ball Grid Array (BGA) and other area array packages have a large...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 260–267.
Published Online: January 11, 2000
... Division for publication in the JOURNAL OF ELECTRONIC PACKAGING . Manuscript received by the EEPD January 11, 2000. 11 January 2000 silicon compounds filled polymers moulding thermal stresses integrated circuit packaging plastic packaging integrated circuit reliability thermal...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2000, 122(3): 279–280.
Published Online: January 9, 2000
... . Manuscript received by the EEPD July 9, 1998; revised manuscript received January 9, 2000. Associate Technical Editor: B. Michel. 09 July 1998 09 January 2000 integrated circuit packaging thermal stresses soldering failure analysis integrated circuit reliability moulding integrated...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 16–18.
Published Online: January 1, 2000
... . Manuscript received by the EEPD January 2000. Associate Editors: B. Courtois and B. Michel. 01 January 2000 integrated circuit packaging plastic packaging moisture environmental degradation moulding encapsulation Plastic encapsulated integrated circuits are gaining interest...