.... , Tang , Z. N. , Miyajima , Y. , Carey , J. D. , and Silva , S.R.P. , 2007 , “ The Importance of Oxygen-Containing Defects on Carbon Nanotubes for the Detection of Polar and Non-Polar Vapours Through Hydrogen Bond Formation ,” Nanotechnology , 18 ( 17 ), p. 175701. 10.1088/0957-4484/18...

... aluminium chromium copper heat transfer molecular dynamics method nanoindentation nanotechnology Young's modulus 24 11 2009 17 01 2011 07 06 2011 07 06 2011 2011 American Society of Mechanical Engineers ...

...-chip devices resins integrated circuit packaging integrated circuit reliability integrated circuit interconnections nanotechnology soldering thermal expansion While flip chip has emerged as an attractive chip packaging methodology because of low cost, high interconnect density, low...

...Anatoly E. Rokhvarger; Lubov A. Chigirinsky Recently awarded U.S. patents and proven in the lab, our versatile high temperature superconductor (HTS) ceramic nanotechnology utilizes a novel material formulation of nanosize HTS ceramic powder and of multi-purpose silicone polymer additive...