1-4 of 4
Keywords: no-flow underfill
Close
Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031005.
Paper No: EP-20-1106
Published Online: January 19, 2021
...Muhammad Naqib Nashrudin; Aizat Abas; M. Z. Abdullah; M. Yusuf Tura Ali; Z. Samsudin The conventional capillary underfill process has been a common practice in the industry, somehow the process is costly and time-consuming. Thus, no-flow underfill process is developed to increase the effective lead...
Journal Articles
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011005.
Paper No: EP-12-1068
Published Online: December 31, 2013
...: Koneru Ramakrishna. 06 07 2012 19 10 2013 No-flow underfill process has exhibited a narrow feasible process window due to electrical assembly yield loss or underfill voiding. In general, the assembly yield can be improved using reflow process designed at high temperature, while...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031014.
Published Online: July 31, 2009
...Sangil Lee; M. J. Yim; Daniel Baldwin This paper investigates the void formation mechanism induced by chemical interaction between eutectic solder (Sn63/Pb37) wetting and no-flow underfill material curing during flip chip in package assembly. During the process, low weight molecular components...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031005.
Published Online: June 23, 2009
...Satoru Katsurayama; Hironori Tohmyoh In flip chip packages, it is common practice for interconnects to be encapsulated with a liquid underfill material. This paper describes the effects of different underfill processes, i.e., the conventional capillary-flow underfill and two no-flow underfill...