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Keywords: parameters identification
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011205.
Paper No: EP-22-1001
Published Online: August 3, 2022
... the Anand model viscoplastic model parameters identification genetic algorithm The Anand model is usually adopted to describe the deformation of solder used in micro-electronics package with viscoplastic characteristics. It is a unified viscoplastic model in which the time-dependent creep...