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Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031003.
Published Online: September 14, 2011
..., temperature of the hot side, and coefficient of performance without the need of using any manufacturer’s proprietary data. In addition, the MGM is designed to analyze a multidimensional-heat-transfer-system utilizing thermoelectric modules (Phan, H., and Agonafer, D., 2010, “Experimental Analysis Model...