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Keywords: scanning electron microscopy
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041007.
Published Online: December 9, 2011
.... The shear strength of five samples tested far exceeds the strength requirement of MIL-STD-883 G standard. 13 02 2011 28 06 2011 09 12 2011 09 12 2011 alumina bonding processes deformation foils gold scanning electron microscopy shear strength silver solders titanium...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021005.
Published Online: June 23, 2011
... section SEM images show that thick Ag, Cu, up to 50 μ m, and Au, up to 70 μ m, were successfully plated over the thin Ni layer that was plated on 304SS. 09 06 2010 05 04 2011 23 06 2011 23 06 2011 electronics packaging grain boundaries grain size scanning electron microscopy...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021003.
Published Online: June 22, 2011
... integrated circuit bonding scanning electron microscopy silicon thermal expansion solid state bonding gold electroplating microstructure silicon chip alumina substrate Even though plastic packages are popular these days, ceramic packages still play as a significant role in high...
Journal Articles
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020905.
Published Online: June 7, 2011
... analysis of the particle size distributions in pristine and functionalized graphite nanoplatelets based on scanning electron microscopy showed an increasing degree of exfoliation of the functionalized material. We compare the performance of the functionalized graphite nanoplatelets and carbon nanotubes...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041014.
Published Online: December 9, 2010
... ( 5 6 7 ). ball bonding bonding parameters gold aluminide surface topographical aluminium alloys gold alloys integrated circuit metallisation integrated circuit packaging lead bonding scanning electron microscopy surface topography 29 07 2009 09 08 2010 09 12...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011014.
Published Online: February 18, 2009
... solder bumps. Scanning electron microscopy and energy dispersive X-ray analysis were used to investigate the intermetallic compound and microvoids of cross-sectioned solder bump. Shear test was used to evaluate the reliabilities of the SnAg bumps. The 13 × 13 area-array Sn/3.0Ag solder bumps of 70 μ m...
Journal Articles
Article Type: Design Innovations
J. Electron. Packag. December 2008, 130(4): 045001.
Published Online: November 14, 2008
.... No bonding medium is used. Scanning electron microscopy images on cross sections of bonded samples exhibit a perfect Ag–Cu bond. 18 12 2007 17 03 2008 14 11 2008 bonding processes copper electronics packaging scanning electron microscopy silver thermal expansion bonding...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. June 2006, 128(2): 130–136.
Published Online: February 14, 2006
... development efforts, surface engineering efforts, and assembly process development efforts. There are several characterization techniques that can be used to characterize the physical behavior of TIMs. Some of these techniques include transmission electron microscopy (TEM), scanning electron microscopy (SEM...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 246–250.
Published Online: November 29, 2005
... of the Al bond pad. In addition, by comprehension of the effects of the multiple zincation process, the study includes investigating the Al dissolution rate and adhesion strength between eutectic a 37 Pb ∕ 63 Sn solder ball and an under bump metallurgy (UBM) interface. Scanning electron microscopy, energy...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 52–58.
Published Online: March 21, 2005
.... 13 January 2004 03 June 2004 21 03 2005 adhesive bonding curing adhesives mechanical testing fracture ultraviolet radiation effects electronics packaging Fourier transform spectra infrared spectra integrated circuit testing integrated circuit bonding scanning electron...
Journal Articles
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 43–46.
Published Online: March 21, 2005
.... The effects of high temperature and high humidity on the bond strength of ACA joints were measured using 90 deg peel test as well as by microstructural examination. It was found that aging generally caused a decrease in peel strength, especially the results of scanning electronic microscopy showed...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
Published Online: March 14, 2003
... impact testing impact strength filled polymers conducting polymers shear strength bending strength scanning electron microscopy Surface mount technology (SMT) continues to be significantly important to the electronics manufacturing industry. Currently, SMT mainly uses lead-tin as soldering...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
Published Online: December 12, 2002
... electron microscopy failure (mechanical) Microstructural examination on the cross-section of a post-impact ICA SM joint indicated the formation of an interface crack between the ICA and the copper pad, as shown in Fig. 10 . This clearly shows that there could be inadequate interfacial strength...
Journal Articles
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
Published Online: July 26, 2002
... properly, could damage even traditional silicon oxide. thermal management (packaging) lead bonding integrated circuit interconnections electronic speckle pattern interferometry scanning electron microscopy flip-chip devices integrated circuit packaging displacement measurement strain...
Journal Articles
Article Type: Papers On Reliability
J. Electron. Packag. September 2001, 123(3): 290–294.
Published Online: July 14, 1999
... cracking reflow soldering integrated circuit reliability scanning electron microscopy cooling solidification sliding friction printed circuit testing 14 July 1999 Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING...