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Keywords: thermal conductivity
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Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2021, 143(3): 034501.
Paper No: EP-20-1091
Published Online: January 19, 2021
... for the military range might be adapted. To make it possible, new joining techniques are developed, one of them is use of pastes with silver nanoparticles sintered with low temperature joining technique. Silver sintered joints have three times higher thermal conductivity and five times lower electrical resistivity...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041001.
Published Online: November 17, 2011
... and thermal conductivity of substrate, on flow field and heat transfer characteristics. It is shown that due to radiative heat transfer, the wall temperatures are brought closer, and the trend of temperature variation along the top wall is significantly altered. Such effects are more pronounced for higher...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020907.
Published Online: June 23, 2011
... compounds palladium compounds photoacoustic effect silicon silver thermal conductivity welds In this study, CNT TIMs enhanced with Pd nanoparticles were fabricated using a previously developed method for CNT synthesis and a new process for bonding interfaces using Pd hexadecanethiolate...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021008.
Published Online: June 23, 2011
... conduction, material thermal conductivity and substrate thickness are investigated in detail. It is found that substrate axial conduction leads to a flatter bulk temperature profile along the channel, lower maximum temperature, and lower Nusselt number. The effect of substrate thickness on the conjugate heat...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021002.
Published Online: June 22, 2011
...Lin Hu; William Evans; Pawel Keblinski We present a concept for development of high thermal conductivity thermal interface materials (TIMs) via a rapid formation of conductive network. In particular we use molecular dynamics simulations to demonstrate the possibility of a formation of a network...
Journal Articles
Publisher: ASME
Article Type: Carbon Nanotubes
J. Electron. Packag. June 2011, 133(2): 020902.
Published Online: June 7, 2011
.... Thickness and pressure measurements indicate that the CNT-thermal grease mixtures are more compliant, with a small increase in bulk thermal conductivity over the range of tested pressures. Total thermal resistance per unit surface area relative to in situ sample thickness for CNT-AS mixtures...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041015.
Published Online: December 9, 2010
...Hung-En Chou; Shang-Ray Yang; Sea-Fue Wang; James C. Sung As a thermal interface material, thermal grease (TG) has been extensively applied to facilitate heat dissipation in electronic devices. Despite the superior thermal conductivity of diamond, researches on diamond-containing TGs remain rare...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2010, 132(2): 021005.
Published Online: June 23, 2010
... in open literature are for single channel microheat pipes. The number of channels in the array and the fluid charge used here were optimized under a separate study. A number of experiments were carried out on the specimen MHPs to determine their effective thermal conductivity and comparisons were made...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2009, 131(3): 034502.
Published Online: July 14, 2009
... for this application because it has moderate thermal conductivity and a low coefficient of thermal expansion, which is close to that of SiC. Materials that show promise for use as a diffusion barrier on Si 3 N 4 substrate for bonding SiC devices to a Si 3 N 4 substrate are refractory metals such as titanium (Ti...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021001.
Published Online: March 27, 2009
... for the flow and heat transfer in conjugate fluid/porous/solid domains. The results indicate that using unfinned blocks of porous aluminum results in low convective heat transfer due to the relatively low effective thermal conductivity of the porous aluminum. The addition of aluminum fins to the heat sink...
Journal Articles
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2009, 131(1): 014501.
Published Online: February 12, 2009
... provides specific information about the thermal path being influenced by the chimney. 25 04 2008 01 07 2008 12 02 2009 cooling natural convection semiconductor device packaging thermal conductivity thermal management (packaging) thermal resistance transistors The use...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031003.
Published Online: July 29, 2008
..., and coolant flow rate. It was found that the high thermal conductivity copper of the direct bonded copper (DBC) layer is the most feasible location for the channels. Based on a new analytical heat transfer model developed for microchannels in IPEM structures, several design configurations were proposed...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2007, 129(4): 504–511.
Published Online: August 19, 2007
... and layer n + 1 ( K m 2 ∕ W ) . Our models assume negligible contact resistance between layers ( 27 ). Anisotropic conductivity is possible by designating k x , n and k y , n , referring to the throughplane ( x direction) and in-plane thermal conductivity...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2007, 129(3): 348–355.
Published Online: December 19, 2006
... chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources. 28 08 2006 19 12 2006 conducting materials thermal conductivity thermal management (packaging...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 319–323.
Published Online: June 1, 2006
... . Heat dissipation is important in the electronic industry in relation to the miniaturization of electronics and electronics packaging. Much attention has been given to the development of materials with high thermal conductivity for electronic devices and heat sinks for the purpose of alleviating...