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Keywords: through-hole technology
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Journal Articles
Journal:
Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
Published Online: November 22, 2021
... Standards Should ,” IPC, Bannockburn, IL, p. 416 , accessed Oct. 1, 2017, http://www.ipc.org/ e-mail: aizatabas@usm.my 11 04 2021 11 08 2021 22 11 2021 SAC305 laser soldering finite volume method through-hole technology Soldering is a crucial fusing process...
