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Issues

Research Papers

Conduction
J. Heat Transfer. April 2016, 138(4): 041301. doi: https://doi.org/10.1115/1.4032172
Electronic Cooling
J. Heat Transfer. April 2016, 138(4): 041401. doi: https://doi.org/10.1115/1.4032176
Evaporation, Boiling, and Condensation
J. Heat Transfer. April 2016, 138(4): 041501. doi: https://doi.org/10.1115/1.4032021
Forced Convection
J. Heat Transfer. April 2016, 138(4): 041701. doi: https://doi.org/10.1115/1.4032288
J. Heat Transfer. April 2016, 138(4): 041702. doi: https://doi.org/10.1115/1.4032330
Heat Transfer Enhancement
J. Heat Transfer. April 2016, 138(4): 041901. doi: https://doi.org/10.1115/1.4032150
Micro/Nanoscale Heat Transfer
J. Heat Transfer. April 2016, 138(4): 042401. doi: https://doi.org/10.1115/1.4032146
J. Heat Transfer. April 2016, 138(4): 042402. doi: https://doi.org/10.1115/1.4032174
Radiative Heat Transfer
J. Heat Transfer. April 2016, 138(4): 042701. doi: https://doi.org/10.1115/1.4032151
J. Heat Transfer. April 2016, 138(4): 042702. doi: https://doi.org/10.1115/1.4032177
Thermal Systems
J. Heat Transfer. April 2016, 138(4): 042801. doi: https://doi.org/10.1115/1.4032171
Two-Phase Flow and Heat Transfer
J. Heat Transfer. April 2016, 138(4): 042901. doi: https://doi.org/10.1115/1.4032147

Technical Brief

J. Heat Transfer. April 2016, 138(4): 044501. doi: https://doi.org/10.1115/1.4032149
J. Heat Transfer. April 2016, 138(4): 044502. doi: https://doi.org/10.1115/1.4032173
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