1-1 of 1
Keywords: diamond scribing
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

Hao Wu, Shreyes N. Melkote
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2012, 134(4): 041011.
https://doi.org/10.1115/1.4006177
Published Online: September 4, 2012
... Vlassak. 09 10 2011 10 02 2012 The ductile-to-brittle cutting mode transition in single grit diamond scribing of monocrystalline silicon is investigated in this paper. Specifically, the effects of scriber tip geometry, coefficient of friction, and external hydrostatic pressure...
View Article titled, Study of Ductile-to-Brittle Transition in Single Grit <span class="search-highlight">Diamond</span> <span class="search-highlight">Scribing</span> of Silicon: Application to Wire Sawing of Silicon Wafers
Open the PDF for Study of Ductile-to-Brittle Transition in Single Grit <span class="search-highlight">Diamond</span> <span class="search-highlight">Scribing</span> of Silicon: Application to Wire Sawing of Silicon Wafers in another window
Topics: Brittleness, Cutting, Diamonds, Fracture (Materials), Friction, Sawing, Shapes, Silicon, Stress, Wire