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Journal Articles

Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers

Hao Wu, Shreyes N. Melkote
Journal: Journal of Engineering Materials and Technology
Publisher: ASME
Article Type: Research-Article
J. Eng. Mater. Technol. October 2012, 134(4): 041011.
https://doi.org/10.1115/1.4006177
Published Online: September 4, 2012
... on the critical depth of cut associated with ductile-to-brittle transition and crack generation are studied via an eXtended Finite Element Method (XFEM) based model, which is experimentally validated. Scribers with a large tip radius are shown to produce lower tensile stresses and a larger critical depth of cut...
View Article titled, Study of <span class="search-highlight">Ductile</span>-to-<span class="search-highlight">Brittle</span> <span class="search-highlight">Transition</span> in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
Open the PDF for Study of <span class="search-highlight">Ductile</span>-to-<span class="search-highlight">Brittle</span> <span class="search-highlight">Transition</span> in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers in another window
Topics: Brittleness, Cutting, Diamonds, Fracture (Materials), Friction, Sawing, Shapes, Silicon, Stress, Wire