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Damena Agonafer
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Journal Articles

Special Section on InterPACK2021

Jin Yang, Przemyslaw Gromala, Sukwon Choi, Damena Agonafer, Patrick McCluskey
Journal: Journal of Electronic Packaging
Article Type: Guest Editorial
J. Electron. Packag. March 2023, 145(1): 010301.
Paper No: EP-22-1094
DOI: https://doi.org/10.1115/1.4056558
Published Online: January 11, 2023
View Article titled, Special Section on InterPACK2021
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Topics: Additive manufacturing, Artificial intelligence, Data centers, Electronic packaging, Electronics, Engineering teachers, Integrated circuit packaging, Integrated circuits, Microelectromechanical systems, Microelectronic devices
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
DOI: https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Li Shan, Shuai Shuai, Binjian Ma, Zichen Du, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. December 2019, 141(4): 041008.
Paper No: EP-19-1038
DOI: https://doi.org/10.1115/1.4044962
Published Online: October 18, 2019
View Article titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Diffusion (Physics), Drops, Evaporation, Vapors, Shapes, Simulation
Proceedings Papers

Numerical Investigation of Shape Effect on Microdroplet Evaporation

Shuai Shuai, Zichen Du, Binjian Ma, Li Shan, Baris Dogruoz, Damena Agonafer
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 27–30, 2018
Paper No: IPACK2018-8311
DOI: https://doi.org/10.1115/IPACK2018-8311
View Paper titled, Numerical Investigation of Shape Effect on Microdroplet Evaporation
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Topics: Evaporation, Shapes, Drops, Vapors, Cooling, Computer cooling, Computer simulation, Design, Diffusion (Physics), Electric fields
Proceedings Papers

Aerogel for Microsystems Thermal Insulation: System Design and Process Development

Brian Smith, David Romero, Damena Agonafer, Jason Gu, Cristina H. Amon
Proc. ASME. HT2005, Heat Transfer: Volume 4, 753-762, July 17–22, 2005
Paper No: HT2005-72663
DOI: https://doi.org/10.1115/HT2005-72663
View Paper titled, Aerogel for Microsystems Thermal Insulation: System Design and Process Development
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Topics: Design, Microelectromechanical systems, Thermal insulation, Microelectronic devices, Crystals, Modeling, Sensors, Computer simulation, Electrical properties, Electronic systems
Proceedings Papers

Heat Pipe Optimization Team: The Heat Pipe Assisted Heat Sink Project

Damena Agonafer, Juan Ibarra, Kendrick McGee, Frank Platt, Kendall Harris, Dereje Aganofer
Proc. ASME. IMECE2004, Innovations in Engineering Education: Mechanical Engineering Education, Mechanical Engineering/Mechanical Engineering Technology Department Heads, 363-372, November 13–19, 2004
Paper No: IMECE2004-62480
DOI: https://doi.org/10.1115/IMECE2004-62480
View Paper titled, Heat Pipe Optimization Team: The Heat Pipe Assisted Heat Sink Project
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Topics: Heat pipes, Heat sinks, Optimization, Teams, Computer cooling, Design, Electronics, Flat heat pipes, Manufacturing, Thermal management
Proceedings Papers

Thermal Enhancement of Stacked Dies Using Thermal Vias

Baekyoung Sung, Krishnateja Chepuri, Yongjie Lee, Dereje Agonafer, Damena Agonafer, Cristina Amon
Proc. ASME. IMECE2006, Heat Transfer, Volume 3, 287-293, November 5–10, 2006
Paper No: IMECE2006-15352
DOI: https://doi.org/10.1115/IMECE2006-15352
View Paper titled, Thermal Enhancement of Stacked Dies Using Thermal Vias
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Topics: Architecture, Circuits, Computer-aided design, Cooling, Density, Flow (Dynamics), Heat, Heat transfer, Packaging, Reliability