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Hideo Iwasaki
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Proceedings Papers

Application of the Thermal Network Method to the Transient Thermal Analysis of Multichip Modules

Masaru Ishizuka, Hideo Iwasaki
Proc. ASME. IMECE97, CAE/CAD and Thermal Management Issues in Electronic Systems, 75-81, November 16–21, 1997
Paper No: IMECE1997-1216
DOI: https://doi.org/10.1115/IMECE1997-1216
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Topics: Multi-chip modules, Thermal analysis, Transients (Dynamics), Density, Design, Electronic circuits, Energy dissipation, Heat, Packaging, Reliability
Proceedings Papers

Micro Channel Heat Exchanger for Cooling Electrical Equipment

Koichiro Kawano, Ko Minakami, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. IMECE98, Heat Transfer: Volume 3 — Application of Heat Transfer in Equipment, Systems, and Education, 173-180, November 15–20, 1998
Paper No: IMECE1998-0650
DOI: https://doi.org/10.1115/IMECE1998-0650
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Topics: Cooling, Electrical components, Heat exchangers, Microchannels, Pressure, Heat, Heat transfer, Computer simulation, Design, Integrated circuits
Proceedings Papers

Thermal Analysis of Stacked Ni-MH Battery

Katsumi Hisano, Hideo Iwasaki, Masaru Ishizuka, Tetsuya Yamane
Proc. ASME. IMECE99, Heat Transfer: Volume 1, 333-337, November 14–19, 1999
Paper No: IMECE1999-1001
DOI: https://doi.org/10.1115/IMECE1999-1001
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Topics: Nickel metal hydride batteries, Thermal analysis, Stress, Pallets, Temperature, Batteries, Numerical analysis, Transportation systems
Proceedings Papers

Numerical Analysis of Two-Dimensional Compressible Viscous Flow in Turbomachinery Cascades Using an Improved k-ε Turbulence Model

Debasish Biswas, Hideo Iwasaki, Masaru Ishizuka
Proc. ASME. GT1997, Volume 1: Aircraft Engine; Marine; Turbomachinery; Microturbines and Small Turbomachinery, V001T03A070, June 2–5, 1997
Paper No: 97-GT-417
DOI: https://doi.org/10.1115/97-GT-417
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Topics: Numerical analysis, Turbomachinery, Turbulence, Viscous flow, Shock (Mechanics), Blades, Flow (Dynamics), Reynolds number, Boundary layers, Compressors
Proceedings Papers

Improvement of Heat Transfer Performance of Loop Heat Pipe for Electronic Devices

Tomonao Takamatsu, Katsumi Hisano, Hideo Iwasaki
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 165-172, July 6–8, 2011
Paper No: IPACK2011-52095
DOI: https://doi.org/10.1115/IPACK2011-52095
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Topics: Heat pipes, Heat transfer, Heat, Cooling, Cooling systems, Water, Bubbles, Flow (Dynamics), Stress, Thermal energy