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Proceedings Papers

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Ji Li, Imin Kao, Vish Prasad

Proc. ASME. IMECE97, Manufacturing Science and Engineering: Volume 1, 439-446, November 16–21, 1997

Paper No: IMECE1997-1121

DOI: https://doi.org/10.1115/IMECE1997-1121

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Topics: Modeling, Semiconductor wafers, Stress, Particulate matter, Wire, Cutting, Silicon, Abrasives, Fracture (Materials), Slurries

Journal Articles

Human-Knowledge-Augmented Gaussian Process Regression for State-of-Health Prediction of Lithium-Ion Batteries With Charging Curves

Quan Zhou, Chongming Wang, Zeyu Sun, Ji Li, Huw Williams, Hongming Xu

J. Electrochem. En. Conv. Stor. August 2021, 18(3): 030907.

Paper No: JEECS-21-1018

DOI: https://doi.org/10.1115/1.4050798

Published Online: April 29, 2021

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Topics: Batteries, Cycles, Feature extraction, Lithium-ion batteries, Testing, Errors, Battery life, Artificial intelligence

Proceedings Papers

Investigation of the Thermo-Mechanical Property of Knitting 3D Polyethylene: A Comparative Study

Bo Zhang, Shan Gao, Yunmin Liang, Ji Li, Peng Mao, Wei Liu, Zhichun Liu

Proc. ASME. MNHMT2019, ASME 2019 6th International Conference on Micro/Nanoscale Heat and Mass Transfer, V001T09A004, July 8–10, 2019

Paper No: MNHMT2019-4029

DOI: https://doi.org/10.1115/MNHMT2019-4029

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Topics: Shear (Mechanics), Thermal conductivity, Thermomechanics, Polymers, Design, Elastic moduli, Molecular dynamics, Molecular dynamics simulation, Shear modulus, Weight (Mass)

Journal Articles

Comparative Study on Thermal Performance of Ultrathin Miniature Loop Heat Pipes With Different Internal Wicks

Guohui Zhou, Ji Li, Lucang Lv, G. P. Peterson

J. Heat Transfer. December 2017, 139(12): 122004.

Paper No: HT-17-1065

DOI: https://doi.org/10.1115/1.4036982

Published Online: June 27, 2017

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Topics: Condensers (steam plant), Copper, Heat, Heat pipes, Heat transfer, Steady state, Stress, Temperature, Thermal resistance, Natural convection

Proceedings Papers

Experimental Study on Heat Transfer Capability of a Miniature Loop Heat Pipe

Guohui Zhou, Ji Li, Lucang Lv

Proc. ASME. IMECE2016, Volume 8: Heat Transfer and Thermal Engineering, V008T10A047, November 11–17, 2016

Paper No: IMECE2016-66566

DOI: https://doi.org/10.1115/IMECE2016-66566

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Topics: Heat pipes, Heat transfer, Heat, Stress, Condensers (steam plant), Fluids, Computer cooling, Computers, Copper, Flow (Dynamics)

Proceedings Papers

Visualization Study of Pool Boiling on Polished and Porous Coated Surfaces for Deionized Water and Al 2 O 3 -Water Nano-Fluids

Gengwen Niu, Ji Li

Proc. ASME. IMECE2013, Volume 8C: Heat Transfer and Thermal Engineering, V08CT09A043, November 15–21, 2013

Paper No: IMECE2013-62346

DOI: https://doi.org/10.1115/IMECE2013-62346

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Topics: Nanofluids, Polishing, Pool boiling, Visualization, Water, Boiling, Coating processes, Coatings, Bubbles, Heat transfer

Proceedings Papers

Laser Shock Induced Nano-Patterning of Graphene

Ji Li, Gary J. Cheng, Rongjun Zhang, Hanqing Jiang

Proc. ASME. MSEC2012, ASME 2012 International Manufacturing Science and Engineering Conference, 545-551, June 4–8, 2012

Paper No: MSEC2012-7378

DOI: https://doi.org/10.1115/MSEC2012-7378

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Topics: Graphene, Lasers, Shock (Mechanics), Pressure, Nanoscale phenomena, Engineering simulation, Laser ablation, Molecular dynamics, Silicon, Simulation

Proceedings Papers

An In-Depth Study on the Mechanical and Thermal Properties of Nanoclay Reinforced Polymers at Various Temperatures

Selen Bayar, Feridun Delale, Benjamin Liaw, Jackie Ji Li, Jerry Chung, Matthew Dabrowski, Ramki Iyer

Proc. ASME. IMECE2010, Volume 12: Processing and Engineering Applications of Novel Materials, 105-110, November 12–18, 2010

Paper No: IMECE2010-37341

DOI: https://doi.org/10.1115/IMECE2010-37341

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Topics: Nanoclays, Polymers, Temperature, Thermal properties, Resins, Nanocomposites, High temperature, Mechanical properties, Stiffness, Weight (Mass)

Proceedings Papers

Laser Shock Based Controlled Forming of Silver Nanowires

Ji Li, Yiliang Liao, Gary J. Cheng

Proc. ASME. MSEC2011, ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2, 463-470, June 13–17, 2011

Paper No: MSEC2011-50301

DOI: https://doi.org/10.1115/MSEC2011-50301

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Topics: Lasers, Nanowires, Shock (Mechanics), Silver, Deformation, Shapes, Dislocation motion, Ductility, Dynamic testing (Materials), Failure

Proceedings Papers

Effect of Multiple Pulses on the Deformation Behavior of Ultrathin Metal Foils in 3D Micro-Scale Laser Dynamic Forming

Ji Li, Gary J. Cheng

Proc. ASME. MSEC2010, ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2, 299-306, October 12–15, 2010

Paper No: MSEC2010-34299

DOI: https://doi.org/10.1115/MSEC2010-34299

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Topics: Deformation, Fracture (Materials), Fracture (Process), Lasers, Metal foil, Microscale devices

Proceedings Papers

A Stabilized Boiling/Evaporation Two-Phase Flow in Microchannels

Ji Li, G. P. Peterson, Chen Li, Guoguang Su

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 9-16, December 18–21, 2009

Paper No: MNHMT2009-18012

DOI: https://doi.org/10.1115/MNHMT2009-18012

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Topics: Boiling, Evaporation, Microchannels, Two-phase flow, Flow (Dynamics), Capillarity, Design, Microelectronic devices, Oscillations, Thermal management

Proceedings Papers

Development of a Robust Miniature Loop Heat Pipe for High Power Chip Cooling

Ji Li, Daming Wang, G. P. Peterson

Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 3, 347-354, December 18–21, 2009

Paper No: MNHMT2009-18011

DOI: https://doi.org/10.1115/MNHMT2009-18011

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Topics: Cooling, Heat pipes, Thermal resistance, Condensers (steam plant), Copper, Copper powders, Design, Heat, Manufacturing, Microscale devices

Journal Articles

Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming

Ji Li, Huang Gao, Gary J. Cheng

J. Manuf. Sci. Eng. December 2010, 132(6): 061005.

DOI: https://doi.org/10.1115/1.4002546

Published Online: October 19, 2010

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Topics: Aluminum, Deformation, Forming limit diagrams, Fracture (Materials), Fracture (Process), Lasers, Failure, Microscale devices, Aluminum foil, Shock (Mechanics)

Journal Articles

A Model on Liquid Penetration Into Soft Material With Application to Needle-Free Jet Injection

Kai Chen, Hua Zhou, Ji Li, Gary J. Cheng

J Biomech Eng. October 2010, 132(10): 101005.

DOI: https://doi.org/10.1115/1.4002487

Published Online: October 1, 2010

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Topics: Energy conservation, Needles, Rubber, Silicon

Proceedings Papers

Molecular Dynamics Computation of Thermal Properties in Si/Ge Nanocomposites

Xiaopeng Huang, Xiulan Huai, Shiqiang Liang, Xinwei Wang, Ji Li

Proc. ASME. IMECE2008, Volume 10: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A, B, and C, 1663-1674, October 31–November 6, 2008

Paper No: IMECE2008-66856

DOI: https://doi.org/10.1115/IMECE2008-66856

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Topics: Computation, Molecular dynamics, Nanocomposites, Thermal properties, Thermal conductivity, Composite materials, Simulation, Dimensions, Heat flux, Nanowires

Proceedings Papers

The Visualization of Thin Film Evaporation on Thin Micro Sintered Copper Mesh Screen

Chen Li, G. P. Peterson, Ji Li, Nikhil Koratkar

Proc. ASME. HT2008, Heat Transfer: Volume 3, 645-650, August 10–14, 2008

Paper No: HT2008-56352

DOI: https://doi.org/10.1115/HT2008-56352

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Topics: Copper, Evaporation, Thin films, Visualization, Heat transfer, Heat flux, Bubbles, Critical heat flux, Drying, Dynamics (Mechanics)

Journal Articles

Finite Element Analysis of Metal Forming Processes on Personal Computers

Li-lai Yan, Song-qing Xu, Guo-ji Li

J. Manuf. Sci. Eng. November 1991, 113(4): 441–445.

DOI: https://doi.org/10.1115/1.2899720

Published Online: November 1, 1991

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Topics: Computers, Finite element analysis, Metalworking, Computation, Shapes

Journal Articles

Closure to “Discussion of ‘Rigid-Plastic Finite-Element Analysis of Plane Strain Rolling’” (1982, ASME J. Eng. Ind., 104, p. 64)

Guo-Ji Li, S. Kobayashi

J. Manuf. Sci. Eng. February 1982, 104(1): 64.

DOI: https://doi.org/10.1115/1.3185799

Published Online: February 1, 1982

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Topics: Finite element analysis, Plane strain

Journal Articles

Rigid-Plastic Finite-Element Analysis of Plane Strain Rolling

Guo-Ji Li, S. Kobayashi

J. Manuf. Sci. Eng. February 1982, 104(1): 55–63.

DOI: https://doi.org/10.1115/1.3185797

Published Online: February 1, 1982

View Article

Topics: Finite element analysis, Plane strain, Deformation, Dimensions, Finite element methods, Materials properties, Pressure, Steady state, Stress, Torque

Journal citation

NARROW

Modeling Stresses of Contacts in Wiresaw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

Human-Knowledge-Augmented Gaussian Process Regression for State-of-Health Prediction of Lithium-Ion Batteries With Charging Curves

Investigation of the Thermo-Mechanical Property of Knitting 3D Polyethylene: A Comparative Study

Comparative Study on Thermal Performance of Ultrathin Miniature Loop Heat Pipes With Different Internal Wicks

Experimental Study on Heat Transfer Capability of a Miniature Loop Heat Pipe

Visualization Study of Pool Boiling on Polished and Porous Coated Surfaces for Deionized Water and Al 2 O 3 -Water Nano-Fluids

Laser Shock Induced Nano-Patterning of Graphene

An In-Depth Study on the Mechanical and Thermal Properties of Nanoclay Reinforced Polymers at Various Temperatures

Laser Shock Based Controlled Forming of Silver Nanowires

Effect of Multiple Pulses on the Deformation Behavior of Ultrathin Metal Foils in 3D Micro-Scale Laser Dynamic Forming

A Stabilized Boiling/Evaporation Two-Phase Flow in Microchannels

Development of a Robust Miniature Loop Heat Pipe for High Power Chip Cooling

Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming

A Model on Liquid Penetration Into Soft Material With Application to Needle-Free Jet Injection

Molecular Dynamics Computation of Thermal Properties in Si/Ge Nanocomposites

The Visualization of Thin Film Evaporation on Thin Micro Sintered Copper Mesh Screen

Finite Element Analysis of Metal Forming Processes on Personal Computers

Closure to “Discussion of ‘Rigid-Plastic Finite-Element Analysis of Plane Strain Rolling’” (1982, ASME J. Eng. Ind., 104, p. 64)

Rigid-Plastic Finite-Element Analysis of Plane Strain Rolling

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